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Hirofumi Ishida

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  • Atsugi-shi, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Cup-shaped plating apparatus
    • Publication number 20040154917
    • Publication date Aug 12, 2004
    • Hirofumi Ishida
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Wafer plating apparatus
    • Publication number 20010017105
    • Publication date Aug 30, 2001
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Hirofumi Ishida
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Wafer plating apparatus
    • Publication number 20010017258
    • Publication date Aug 30, 2001
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Hirofumi Ishida
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR