Hirofumi Kurosawa

Person

Nagano-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device package and electronic equipment
- Patent number 7,964,955
- Issue date Jun 21, 2011
- Seiko Epson Corporation
- Hirofumi Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrophoresis display and electronic apparatus including an elect...
- Patent number 7,692,847
- Issue date Apr 6, 2010
- Seiko Epson Corporation
- Hirofumi Kurosawa
- G02 - OPTICS
Information Patent Grant
Contactless data communication system, contactless identification t...
- Patent number 7,538,677
- Issue date May 26, 2009
- Seiko Epson Corporation
- Masaki Hoshina
- G08 - SIGNALLING
Information Patent Grant
Method for mounting an electronic element on a wiring board
- Patent number 7,454,831
- Issue date Nov 25, 2008
- Seiko Epson Corporation
- Hirofumi Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered wiring board, method of producing multilayered wiring...
- Patent number 7,285,305
- Issue date Oct 23, 2007
- Seiko Epson Corporation
- Masahiro Furusawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming pattern and method for forming multilayer wiring...
- Patent number 7,226,520
- Issue date Jun 5, 2007
- Seiko Epson Corporation
- Hirofumi Kurosawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method of manufacturing the same, semiconductor devic...
- Patent number 7,189,598
- Issue date Mar 13, 2007
- Seiko Epson Corporation
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contactless data communication system, countactless identification...
- Patent number 7,135,975
- Issue date Nov 14, 2006
- Seiko Epson Corporation
- Masaki Hoshina
- G08 - SIGNALLING
Information Patent Grant
Optical disk stamper examination machine, optical disk stamper exam...
- Patent number 6,635,896
- Issue date Oct 21, 2003
- Seiko Epson Corporation
- Kimio Hirono
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Timepiece Component Decoration Method And Timepiece Component
- Publication number 20230297031
- Publication date Sep 21, 2023
- SEIKO EPSON CORPORATION
- Toshinori NAKAZAWA
- G04 - HOROLOGY
Information Patent Application
Dial Decoration Method And Dial
- Publication number 20230297032
- Publication date Sep 21, 2023
- SEIKO EPSON CORPORATION
- Toshinori NAKAZAWA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTROPHORESIS DISPLAY AND ELECTRONIC APPARATUS
- Publication number 20090153947
- Publication date Jun 18, 2009
- SEIKO EPSON CORPORATION
- Hirofumi Kurosawa
- G02 - OPTICS
Information Patent Application
Wiring board, method of manufacturing the same, semiconductor devic...
- Publication number 20070094870
- Publication date May 3, 2007
- SEIKO EPSON CORPORATION
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACTLESS DATA COMMUNICATION SYSTEM, CONTACTLESS IDENTIFICATION T...
- Publication number 20070018827
- Publication date Jan 25, 2007
- SEIKO EPSON CORPORATION
- Masaki HOSHINA
- G08 - SIGNALLING
Information Patent Application
Electronic device package and electronic equipment
- Publication number 20060103000
- Publication date May 18, 2006
- Seiko Epson Corporation
- Hirofumi Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for mounting electronic element, method for producing electr...
- Publication number 20060103788
- Publication date May 18, 2006
- Seiko Epson Corporation
- Hirofumi Kurosawa
- G02 - OPTICS
Information Patent Application
Method for forming pattern and method for forming multilayer wiring...
- Publication number 20040239730
- Publication date Dec 2, 2004
- Hirofumi Kurosawa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Wiring board, method of manufacturing the same, semiconductor devic...
- Publication number 20040237296
- Publication date Dec 2, 2004
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, method of manufacturing the same, semiconductor devic...
- Publication number 20040241903
- Publication date Dec 2, 2004
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contactless data communication system, contactless identification t...
- Publication number 20040222889
- Publication date Nov 11, 2004
- Masaki Hoshina
- G08 - SIGNALLING
Information Patent Application
Multilayered wiring board, method of producing multilayered wiring...
- Publication number 20040000429
- Publication date Jan 1, 2004
- Masahiro Furusawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hirofumi Kurosawa

Person

Patents Grantslast 30 patents

Electronic device package and electronic equipment

Electrophoresis display and electronic apparatus including an elect...

Contactless data communication system, contactless identification t...

Method for mounting an electronic element on a wiring board

Multilayered wiring board, method of producing multilayered wiring...

Method for forming pattern and method for forming multilayer wiring...

Wiring board, method of manufacturing the same, semiconductor devic...

Contactless data communication system, countactless identification...

Optical disk stamper examination machine, optical disk stamper exam...

Patents Applicationslast 30 patents

Timepiece Component Decoration Method And Timepiece Component

Dial Decoration Method And Dial

ELECTROPHORESIS DISPLAY AND ELECTRONIC APPARATUS

Wiring board, method of manufacturing the same, semiconductor devic...

CONTACTLESS DATA COMMUNICATION SYSTEM, CONTACTLESS IDENTIFICATION T...

Electronic device package and electronic equipment

Method for mounting electronic element, method for producing electr...

Method for forming pattern and method for forming multilayer wiring...

Wiring board, method of manufacturing the same, semiconductor devic...

Wiring board, method of manufacturing the same, semiconductor devic...

Contactless data communication system, contactless identification t...

Multilayered wiring board, method of producing multilayered wiring...