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Hirofumi Moroe
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Musashimurayama, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method for forming pin-form wires and the like
Patent number
6,687,988
Issue date
Feb 10, 2004
Kabushiki Kaisha Shinkawa
Kazuo Sugiura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for positioning a semiconductor pellet
Patent number
6,632,703
Issue date
Oct 14, 2003
Kabushiki Kaisha Shinkawa
Hiroshi Ushiki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming pin-form wires and the like
Patent number
6,581,283
Issue date
Jun 24, 2003
Kabushiki Kaisha Shinkawa
Kazuo Sugiura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for positioning a semiconductor pellet
Patent number
6,505,823
Issue date
Jan 14, 2003
Kabushiki Kaisha Shinkawa
Hiroshi Ushiki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump bonding apparatus
Patent number
6,193,130
Issue date
Feb 27, 2001
Kabushiki Kaisha Shinkawa
Hiroshi Ushiki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bump forming method
Patent number
5,953,624
Issue date
Sep 14, 1999
Kabushiki Kaisha Shinkawa
Akio Bando
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer conveying apparatus
Patent number
5,848,868
Issue date
Dec 15, 1998
Kabushiki Kaisha Shinkawa
Yasunobu Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD AND APPARATUS FOR POSITIONING A SEMICONDUCTOR PELLET
Publication number
20020175202
Publication date
Nov 28, 2002
HIROSHI USHIKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus for positioning a semiconductor pellet
Publication number
20010005640
Publication date
Jun 28, 2001
KABUSHIKI KAISHA SHINKAWA
Hiroshi Ushiki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for forming pin-form wires and the like
Publication number
20010002607
Publication date
Jun 7, 2001
Kazuo Sugiura
H01 - BASIC ELECTRIC ELEMENTS