Hirofumi OTAKI

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing method including reprocessing rejected wafers
- Patent number 9,847,263
- Issue date Dec 19, 2017
- Ebara Corporation
- Hirofumi Otaki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 9,524,913
- Issue date Dec 20, 2016
- Ebara Corporation
- Tsuneo Torikoshi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, AND MACHINE LEARNI...
- Publication number 20240338017
- Publication date Oct 10, 2024
- EBARA CORPORATION
- CHING WEI HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION PROCESSING DEVICE, SUBSTRATE PROCESSING DEVICE, AND INF...
- Publication number 20240302817
- Publication date Sep 12, 2024
- EBARA CORPORATION
- HIROFUMI OTAKI
- G05 - CONTROLLING REGULATING
Information Patent Application
INFORMATION PROCESSING APPARATUS AND MACHINE LEARNING APPARATUS
- Publication number 20240062066
- Publication date Feb 22, 2024
- EBARA CORPORATION
- CHING WEI HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MACHINE LEARNING DEVICE, SUBSTRATE PROCESSING DEVICE, TRAINED MODEL...
- Publication number 20220344164
- Publication date Oct 27, 2022
- EBARA CORPORATION
- Akira NAKAMURA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20150279751
- Publication date Oct 1, 2015
- EBARA CORPORATION
- Hirofumi OTAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20150221562
- Publication date Aug 6, 2015
- EBARA CORPORATION
- Tsuneo TORIKOSHI
- H01 - BASIC ELECTRIC ELEMENTS