TREA

Hirofumi Saito

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  • Nagano, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Resin molding apparatus
    • Patent number 11,784,069
    • Issue date Oct 10, 2023
    • Apic Yamada Corporation
    • Masahiko Fujisawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Resin molding apparatus
    • Patent number 11,699,604
    • Issue date Jul 11, 2023
    • ABIC YAMADA CORPORATION
    • Masahiko Fujisawa
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    RESIN MOLDING DEVICE
    • Publication number 20210362379
    • Publication date Nov 25, 2021
    • Apic Yamada Corporation
    • Masahiko Fujisawa
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    RESIN MOLDING DEVICE
    • Publication number 20210362382
    • Publication date Nov 25, 2021
    • Apic Yamada Corporation
    • Masahiko Fujisawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN MOLDING APPARATUS AND CLEANING METHOD
    • Publication number 20210351045
    • Publication date Nov 11, 2021
    • Apic Yamada Corporation
    • Masahiko FUJISAWA
    • B08 - CLEANING
  • Information Patent Application

    RESIN MOLDING APPARATUS
    • Publication number 20210335633
    • Publication date Oct 28, 2021
    • Apic Yamada Corporation
    • Masahiko Fujisawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN MOLDING APPARATUS
    • Publication number 20210335632
    • Publication date Oct 28, 2021
    • Apic Yamada Corporation
    • Masahiko Fujisawa
    • H01 - BASIC ELECTRIC ELEMENTS