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Hirofumi Shimoda
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Tokyo, JP
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last 30 patents
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Patent Grant
Wafer surface observation apparatus
Patent number
7,565,002
Issue date
Jul 21, 2009
Tokyo Seimitsu Co., Ltd.
Hiroyuki Yasutomi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Dicing apparatus and dicing method
Publication number
20070087661
Publication date
Apr 19, 2007
TOKYO SEIMITSU CO., LTD.
Masanobu KOYATA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Application
Wafer observation position designating apparatus and wafer display...
Publication number
20050105790
Publication date
May 19, 2005
Hiroyuki Yasutomi
H01 - BASIC ELECTRIC ELEMENTS