Hirofumi SHINAGAWA

Person

Nagaokakyo-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Component-embedded substrate and substrate flaw detecting method
- Patent number 10,338,031
- Issue date Jul 2, 2019
- Murata Manufacturing Co., Ltd.
- Shigeru Tago
- G01 - MEASURING TESTING
Information Patent Grant
Component built-in substrate
- Patent number 10,231,342
- Issue date Mar 12, 2019
- Murata Manufacturing Co., Ltd.
- Shigeru Tago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer resin substrate, and method of manufacturing multilayer...
- Patent number 10,219,367
- Issue date Feb 26, 2019
- Murata Manufacturing Co., Ltd.
- Hirofumi Shinagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module including multilayer base body, image sensor IC, lens...
- Patent number 9,986,139
- Issue date May 29, 2018
- Murata Manufacturing Co., Ltd.
- Shigeru Tago
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Component-embedded substrate
- Patent number 9,974,185
- Issue date May 15, 2018
- Murata Manufacturing Co., Ltd.
- Shigeru Tago
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing resin multilayer board
- Patent number 9,961,780
- Issue date May 1, 2018
- Murata Manufacturing Co., Ltd.
- Hirofumi Shinagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for stacked module, stacked module, and method for manufa...
- Patent number 9,922,918
- Issue date Mar 20, 2018
- Murata Manufacturing Co., Ltd.
- Shigeru Tago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module component
- Patent number 9,854,677
- Issue date Dec 26, 2017
- Murata Manufacturing Co., Ltd.
- Shigeru Tago
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Multilayer resin substrate, and method of manufacturing multilayer...
- Patent number 9,848,489
- Issue date Dec 19, 2017
- Murata Manufacturing Co., Ltd.
- Hirofumi Shinagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module including multilayer base body, image sensor IC, lens...
- Patent number 9,813,595
- Issue date Nov 7, 2017
- Murata Manufacturing Co., Ltd.
- Shigeru Tago
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Component-embedded substrate and communication module
- Patent number 9,629,249
- Issue date Apr 18, 2017
- Murata Manufacturing Co., Ltd.
- Shigeru Tago
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER...
- Publication number 20180070435
- Publication date Mar 8, 2018
- Murata Manufacturing Co., Ltd.
- Hirofumi SHINAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE INCLUDING MULTILAYER BASE BODY, IMAGE SENSOR IC, LENS...
- Publication number 20180027154
- Publication date Jan 25, 2018
- Murata Manufacturing Co., Ltd.
- Shigeru TAGO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMPONENT BUILT-IN SUBSTRATE AND METHOD FOR MANUFACTURING COMPONENT...
- Publication number 20170223837
- Publication date Aug 3, 2017
- Murata Manufacturing Co., Ltd.
- Shigeru TAGO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE AND SUBSTRATE FLAW DETECTING METHOD
- Publication number 20170176392
- Publication date Jun 22, 2017
- Murata Manufacturing Co., Ltd.
- Shigeru TAGO
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE FOR STACKED MODULE, STACKED MODULE, AND METHOD FOR MANUFA...
- Publication number 20170179014
- Publication date Jun 22, 2017
- Murata Manufacturing Co., Ltd.
- Shigeru TAGO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE COMPONENT
- Publication number 20160330843
- Publication date Nov 10, 2016
- Murata Manufacturing Co., Ltd.
- Shigeru TAGO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20160157354
- Publication date Jun 2, 2016
- MURATA MANUFACTURING CO., LTD.
- Shigeru TAGO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE AND COMMUNICATION MODULE
- Publication number 20160066428
- Publication date Mar 3, 2016
- MURATA MANUFACTURING CO., LTD.
- Shigeru Tago
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING RESIN MULTILAYER BOARD
- Publication number 20160050766
- Publication date Feb 18, 2016
- MURATA MANUFACTURING CO., LTD.
- Hirofumi Shinagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER...
- Publication number 20160037622
- Publication date Feb 4, 2016
- Murata Manufacturing Co., Ltd.
- Hirofumi SHINAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE AND ELECTRONIC DEVICE
- Publication number 20150373238
- Publication date Dec 24, 2015
- Murata Manufacturing Co., Ltd.
- Shigeru TAGO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Hirofumi SHINAGAWA

Person

Patents Grantslast 30 patents

Component-embedded substrate and substrate flaw detecting method

Component built-in substrate

Multilayer resin substrate, and method of manufacturing multilayer...

Camera module including multilayer base body, image sensor IC, lens...

Component-embedded substrate

Method for manufacturing resin multilayer board

Substrate for stacked module, stacked module, and method for manufa...

Module component

Multilayer resin substrate, and method of manufacturing multilayer...

Camera module including multilayer base body, image sensor IC, lens...

Component-embedded substrate and communication module

Patents Applicationslast 30 patents

MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER...

CAMERA MODULE INCLUDING MULTILAYER BASE BODY, IMAGE SENSOR IC, LENS...

COMPONENT BUILT-IN SUBSTRATE AND METHOD FOR MANUFACTURING COMPONENT...

COMPONENT-EMBEDDED SUBSTRATE AND SUBSTRATE FLAW DETECTING METHOD

SUBSTRATE FOR STACKED MODULE, STACKED MODULE, AND METHOD FOR MANUFA...

MODULE COMPONENT

COMPONENT-EMBEDDED SUBSTRATE

COMPONENT-EMBEDDED SUBSTRATE AND COMMUNICATION MODULE

METHOD FOR MANUFACTURING RESIN MULTILAYER BOARD

MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER...

CAMERA MODULE AND ELECTRONIC DEVICE