Hirofumi Tokita

Person

Yokkaichi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory device including through-memory-level via...
- Patent number 11,398,488
- Issue date Jul 26, 2022
- SanDisk Technologies LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-stack contact via structures for a three-dimensional memory...
- Patent number 11,367,736
- Issue date Jun 21, 2022
- SanDisk Technologies LLC
- Hirofumi Tokita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-stack contact via structures for a three-dimensional memory...
- Patent number 11,355,506
- Issue date Jun 7, 2022
- SanDisk Technologies LLC
- Hirofumi Tokita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-stack contact via structures for a three-dimensional memory...
- Patent number 11,342,245
- Issue date May 24, 2022
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing horizontal and vertical...
- Patent number 11,139,237
- Issue date Oct 5, 2021
- SanDisk Technologies LLC
- Shiqian Shao
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device containing horizontal and vertical...
- Patent number 11,133,252
- Issue date Sep 28, 2021
- SanDisk Technologies LLC
- Koichi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing width-modulated connecti...
- Patent number 11,114,459
- Issue date Sep 7, 2021
- SanDisk Technologies LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing through-array contact vi...
- Patent number 10,872,857
- Issue date Dec 22, 2020
- SanDisk Technologies LLC
- Yoshitaka Otsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP STRUCTURES FOR...
- Publication number 20240251560
- Publication date Jul 25, 2024
- SANDISK TECHNOLOGIES LLC
- Toshiyuki ISOME
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP STRUCTURES FOR...
- Publication number 20240179907
- Publication date May 30, 2024
- SANDISK TECHNOLOGIES LLC
- Hirofumi TOKITA
Information Patent Application
MULTI-TIER MEMORY DEVICE WITH DIFFERENT WIDTH CENTRAL STAIRCASE REG...
- Publication number 20240121959
- Publication date Apr 11, 2024
- SANDISK TECHNOLOGIES LLC
- Hirofumi TOKITA
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING THROUGH-MEMORY-LEVEL VIA...
- Publication number 20210384206
- Publication date Dec 9, 2021
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-STACK CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...
- Publication number 20210366920
- Publication date Nov 25, 2021
- SANDISK TECHNOLOGIES LLC
- Hirofumi TOKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-STACK CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...
- Publication number 20210366808
- Publication date Nov 25, 2021
- SANDISK TECHNOLOGIES LLC
- Zhixin CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-STACK CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...
- Publication number 20210366924
- Publication date Nov 25, 2021
- SANDISK TECHNOLOGIES LLC
- Hirofumi TOKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HORIZONTAL AND VERTICAL...
- Publication number 20210242128
- Publication date Aug 5, 2021
- SANDISK TECHNOLOGIES LLC
- Koichi ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING WIDTH-MODULATED CONNECTI...
- Publication number 20210134827
- Publication date May 6, 2021
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HORIZONTAL AND VERTICAL...
- Publication number 20210057336
- Publication date Feb 25, 2021
- SANDISK TECHNOLOGIES LLC
- Shiqian SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-ARRAY CONTACT VI...
- Publication number 20200402905
- Publication date Dec 24, 2020
- SANDISK TECHNOLOGIES LLC
- Yoshitaka OTSU
- H01 - BASIC ELECTRIC ELEMENTS

Hirofumi Tokita

Person

Patents Grantslast 30 patents

Three-dimensional memory device including through-memory-level via...

Through-stack contact via structures for a three-dimensional memory...

Through-stack contact via structures for a three-dimensional memory...

Through-stack contact via structures for a three-dimensional memory...

Three-dimensional memory device containing horizontal and vertical...

Three-dimensional memory device containing horizontal and vertical...

Three-dimensional memory device containing width-modulated connecti...

Three-dimensional memory device containing through-array contact vi...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP STRUCTURES FOR...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP STRUCTURES FOR...

MULTI-TIER MEMORY DEVICE WITH DIFFERENT WIDTH CENTRAL STAIRCASE REG...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING THROUGH-MEMORY-LEVEL VIA...

THROUGH-STACK CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...

THROUGH-STACK CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...

THROUGH-STACK CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HORIZONTAL AND VERTICAL...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING WIDTH-MODULATED CONNECTI...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HORIZONTAL AND VERTICAL...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-ARRAY CONTACT VI...