Hirohide Yano

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Testing apparatus
- Patent number 11,474,143
- Issue date Oct 18, 2022
- Disco Corporation
- Makoto Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer inspection method and wafer inspection apparatus
- Patent number 9,953,407
- Issue date Apr 24, 2018
- Disco Corporation
- Yusaku Ito
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer processing method
- Patent number 9,881,828
- Issue date Jan 30, 2018
- Disco Corporation
- Shinji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer inspection method and grinding and polishing apparatus
- Patent number 9,616,544
- Issue date Apr 11, 2017
- Disco Corporation
- Yusaku Ito
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
OPERATION ACCURACY MEASURING METHOD
- Publication number 20220397387
- Publication date Dec 15, 2022
- Disco Corporation
- Atsushi ODA
- G01 - MEASURING TESTING
Information Patent Application
TESTING APPARATUS
- Publication number 20200182923
- Publication date Jun 11, 2020
- Disco Corporation
- Makoto KOBAYASHI
- G01 - MEASURING TESTING
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170213756
- Publication date Jul 27, 2017
- Disco Corporation
- Shinji Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER INSPECTION METHOD AND WAFER INSPECTION APPARATUS
- Publication number 20160098828
- Publication date Apr 7, 2016
- Disco Corporation
- Yusaku Ito
- G01 - MEASURING TESTING
Information Patent Application
WAFER INSPECTION METHOD AND GRINDING AND POLISHING APPARATUS
- Publication number 20160059375
- Publication date Mar 3, 2016
- Disco Corporation
- Yusaku Ito
- G06 - COMPUTING CALCULATING COUNTING