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Hirohiko WATANABE

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  • Hachioji-city, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Solder joint
    • Patent number 11,890,702
    • Issue date Feb 6, 2024
    • Fuji Electric Co., Ltd.
    • Hirohiko Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder material
    • Patent number 11,850,685
    • Issue date Dec 26, 2023
    • Fuji Electric Co., Ltd.
    • Hirohiko Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder material for semiconductor device
    • Patent number 11,145,615
    • Issue date Oct 12, 2021
    • Fuji Electric Co., Ltd.
    • Hirohiko Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder material for semiconductor device
    • Patent number 10,727,194
    • Issue date Jul 28, 2020
    • Fuji Electric Co., Ltd.
    • Hirohiko Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder joining
    • Patent number 10,504,868
    • Issue date Dec 10, 2019
    • Fuji Electric Co., Ltd.
    • Hirohiko Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy for die bonding
    • Patent number 10,189,119
    • Issue date Jan 29, 2019
    • Nihon Handa Co., Ltd.
    • Takeshi Asagi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free soldering method and soldered article
    • Patent number 10,002,845
    • Issue date Jun 19, 2018
    • Fuji Electric Co., Ltd.
    • Hirohiko Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Manufacturing method of semiconductor module including solid-liquid...
    • Patent number 7,670,879
    • Issue date Mar 2, 2010
    • Fuji Electric Holdings Co., Ltd.
    • Kozo Fujimoto
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SOLDER MATERIAL
    • Publication number 20250041977
    • Publication date Feb 6, 2025
    • Fuji Electric Co., Ltd.
    • Kohei MITSUI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER JOINT
    • Publication number 20240109157
    • Publication date Apr 4, 2024
    • Fuji Electric Co., Ltd.
    • Hirohiko WATANABE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER MATERIAL
    • Publication number 20240075559
    • Publication date Mar 7, 2024
    • Fuji Electric Co., Ltd.
    • Hirohiko WATANABE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
    • Publication number 20210407953
    • Publication date Dec 30, 2021
    • Fuji Electric Co., Ltd.
    • Hirohiko WATANABE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER JOINT
    • Publication number 20210138590
    • Publication date May 13, 2021
    • Fuji Electric Co., Ltd.
    • Hirohiko WATANABE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
    • Publication number 20200303337
    • Publication date Sep 24, 2020
    • Fuji Electric Co., Ltd.
    • Hirohiko WATANABE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER MATERIAL
    • Publication number 20190193210
    • Publication date Jun 27, 2019
    • Fuji Electric Co., Ltd.
    • Hirohiko WATANABE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER JOINING
    • Publication number 20180277506
    • Publication date Sep 27, 2018
    • Fuji Electric Co., Ltd.
    • Hirohiko WATANABE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
    • Publication number 20180033761
    • Publication date Feb 1, 2018
    • Fuji Electric Co., Ltd.
    • Hirohiko WATANABE
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE
    • Publication number 20170012018
    • Publication date Jan 12, 2017
    • Fuji Electric Co., Ltd.
    • Hirohiko WATANABE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLUX FOR SOLDERING AND SOLDER COMPOSITION
    • Publication number 20160332262
    • Publication date Nov 17, 2016
    • FUJI ELECTRIC CO., LTD.
    • Ikuo SHOHJI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER ALLOY FOR DIE BONDING
    • Publication number 20150258637
    • Publication date Sep 17, 2015
    • Nihon Handa Co., Ltd.
    • Takeshi Asagi
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    FLUX FOR RESIN CORED SOLDER AND RESIN CORED SOLDER
    • Publication number 20150044465
    • Publication date Feb 12, 2015
    • Fuji Electric Co., Ltd.
    • Tatsuya GANBE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Manufacturing method of semiconductor module
    • Publication number 20070197017
    • Publication date Aug 23, 2007
    • Fuji Electric Holdings Co., Ltd.
    • Kozo Fujimoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic part mounting method
    • Publication number 20070152025
    • Publication date Jul 5, 2007
    • Fuji Electric Holdings Co., Ltd.
    • Kozo Fujimoto
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR