Hirohisa Amago

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of inspecting semiconductor thin film by transmission imagin...
- Patent number 8,404,498
- Issue date Mar 26, 2013
- Sony Corporation
- Hirohisa Amago
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming semiconductor thin film and semiconductor thin fi...
- Patent number 8,193,008
- Issue date Jun 5, 2012
- Sony Corporation
- Nobuhiko Umezu
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board having through-hole stopped with photo-curabl...
- Patent number 5,402,314
- Issue date Mar 28, 1995
- Sony Corporation
- Hirohisa Amago
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SEMICONDUCTOR THIN FILM AND SEMICONDUCTOR THIN FI...
- Publication number 20120231559
- Publication date Sep 13, 2012
- SONY CORPORATION
- Nobuhiko Umezu
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT SUBSTRATE AND MANUFACTURING METHOD OF CIRCUIT SUBSTRATE
- Publication number 20120111619
- Publication date May 10, 2012
- SONY CORPORATION
- Hirohisa Amago
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR THIN FILM AND INSPECTION DEVICE OF...
- Publication number 20090298208
- Publication date Dec 3, 2009
- SONY CORPORATION
- Hirohisa Amago
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR THIN FILM AND SEMICONDUCTOR THIN FI...
- Publication number 20090291511
- Publication date Nov 26, 2009
- SONY CORPORATION
- Nobuhiko Umezu
- G01 - MEASURING TESTING