Hirohisa Narahashi

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Support, adhesive sheet, laminated structure, semiconductor device,...
- Patent number 11,482,437
- Issue date Oct 25, 2022
- Ajinomoto Co., Inc.
- Masanori Ohkoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support, adhesive sheet, laminated structure, semiconductor device,...
- Patent number 11,121,020
- Issue date Sep 14, 2021
- Ajinomoto Co., Inc.
- Masanori Ohkoshi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for producing multilayer printed wiring board
- Patent number 8,584,352
- Issue date Nov 19, 2013
- Ajinomoto Co., Inc.
- Hirohisa Narahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-clad laminate
- Patent number 8,382,996
- Issue date Feb 26, 2013
- Ajinomoto Co., Inc.
- Hirohisa Narahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate including water soluble release layer for producing circui...
- Patent number 8,357,443
- Issue date Jan 22, 2013
- Ajinomoto Co., Inc.
- Hirohisa Narahashi
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
SUPPORT, ADHESIVE SHEET, LAMINATED STRUCTURE, SEMICONDUCTOR DEVICE,...
- Publication number 20200219750
- Publication date Jul 9, 2020
- AJINOMOTO CO, INC
- Masanori OHKOSHI
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING PRINTED WIRING BOARD
- Publication number 20170290148
- Publication date Oct 5, 2017
- AJINOMOTO CO., INC.
- Masanori OHKOSHI
- B32 - LAYERED PRODUCTS
Information Patent Application
SUPPORT, ADHESIVE SHEET, LAMINATED STRUCTURE, SEMICONDUCTOR DEVICE,...
- Publication number 20170221745
- Publication date Aug 3, 2017
- AJINOMOTO CO., INC.
- Masanori OHKOSHI
- B32 - LAYERED PRODUCTS
Information Patent Application
PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
- Publication number 20110036625
- Publication date Feb 17, 2011
- AJINOMOTO CO., INC.
- HIROHISA NARAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-CLAD LAMINATE
- Publication number 20100230382
- Publication date Sep 16, 2010
- AJINOMOTO CO. INC.
- Hirohisa NARAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRODUCING CIRCUIT BOARD
- Publication number 20100044078
- Publication date Feb 25, 2010
- AJINOMOTO CO., INC.
- Hirohisa Narahashi
- B32 - LAYERED PRODUCTS
Information Patent Application
FILM FOR METAL FILM TRANSFER, METHOD FOR TRANSFERRING METAL FILM AN...
- Publication number 20100040874
- Publication date Feb 18, 2010
- AJINOMOTO CO., INC.
- Hirohisa Narahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hirohisa Narahashi

Person

Patents Grantslast 30 patents

Support, adhesive sheet, laminated structure, semiconductor device,...

Support, adhesive sheet, laminated structure, semiconductor device,...

Process for producing multilayer printed wiring board

Metal-clad laminate

Laminate including water soluble release layer for producing circui...

Patents Applicationslast 30 patents

SUPPORT, ADHESIVE SHEET, LAMINATED STRUCTURE, SEMICONDUCTOR DEVICE,...

METHOD FOR PRODUCING PRINTED WIRING BOARD

SUPPORT, ADHESIVE SHEET, LAMINATED STRUCTURE, SEMICONDUCTOR DEVICE,...

PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD

METAL-CLAD LAMINATE

PROCESS FOR PRODUCING CIRCUIT BOARD

FILM FOR METAL FILM TRANSFER, METHOD FOR TRANSFERRING METAL FILM AN...