Hirohito Miyashita

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Copper alloy sputtering target and semiconductor element wiring
- Patent number 10,665,462
- Issue date May 26, 2020
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper alloy sputtering target and method for manufacturing the target
- Patent number 9,896,745
- Issue date Feb 20, 2018
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Sputtering target, sputtering target-backing plate assembly and dep...
- Patent number 9,685,307
- Issue date Jun 20, 2017
- JX Nippon Mining & Metals Corporation
- Hirohito Miyashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper or copper alloy target/copper alloy backing plate assembly
- Patent number 9,472,383
- Issue date Oct 18, 2016
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Hafnium alloy target
- Patent number 8,262,816
- Issue date Sep 11, 2012
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy sputtering target and semiconductor element wiring
- Patent number 8,246,764
- Issue date Aug 21, 2012
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Hafnium alloy target
- Patent number 8,241,438
- Issue date Aug 14, 2012
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Sputtering target
- Patent number 8,177,947
- Issue date May 15, 2012
- JX Nippon Mining & Metals Corporation
- Hirohito Miyashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hafnium alloy target and process for producing the same
- Patent number 8,062,440
- Issue date Nov 22, 2011
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Target of high-purity nickel or nickel alloy and its producing method
- Patent number 7,740,718
- Issue date Jun 22, 2010
- Nippon Mining & Metals Co., Ltd.
- Yasuhiro Yamakoshi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Target of high-purity nickel or nickel alloy and its producing method
- Patent number 7,618,505
- Issue date Nov 17, 2009
- Nippon Mining & Metals Co., Ltd.
- Yasuhiro Yamakoshi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy sputtering target and semiconductor element wiring
- Patent number 7,507,304
- Issue date Mar 24, 2009
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Hafnium alloy target and process for producing the same
- Patent number 7,459,036
- Issue date Dec 2, 2008
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrolytic copper plating method, phosphorous copper anode for el...
- Patent number 7,138,040
- Issue date Nov 21, 2006
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Sputtering target producing few particles
- Patent number 6,875,325
- Issue date Apr 5, 2005
- Nikko Materials Company Limited
- Hirohito Miyashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering target producing few particles, backing plate or sputter...
- Patent number 6,858,116
- Issue date Feb 22, 2005
- Nikko Materials Company, Limited
- Takeo Okabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Diffusion-joined target assemly of high-purity cobalt target and co...
- Patent number 6,793,124
- Issue date Sep 21, 2004
- Nikko Materials Company, Limited
- Kazushige Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tantalum or tungsten target-copper alloy backing plate assembly and...
- Patent number 6,759,143
- Issue date Jul 6, 2004
- Nikko Materials Company, Limited
- Kunihiro Oda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicide target for depositing less embrittling gate oxide and meth...
- Patent number 6,723,183
- Issue date Apr 20, 2004
- Nikko Materials Company, Limited
- Kunihiro Oda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten target for sputtering and method for preparing thereof
- Patent number 6,582,535
- Issue date Jun 24, 2003
- Nikko Materials Company, Limited
- Satoru Suzuki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Sputtering target and method for manufacturing thereof
- Patent number 6,153,315
- Issue date Nov 28, 2000
- Japan Energy Corporation
- Yasuhiro Yamakoshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Copper Alloy Sputtering Target and Semiconductor Element Wiring
- Publication number 20180211841
- Publication date Jul 26, 2018
- JX NIPPON MINING & METALS CORPORATION
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper Alloy Sputtering Target and Semiconductor Element Wiring
- Publication number 20090139863
- Publication date Jun 4, 2009
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper Alloy Sputtering Target and Semiconductor Element Wiring
- Publication number 20090140430
- Publication date Jun 4, 2009
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Hafnium Alloy Target and Process for Producing the Same
- Publication number 20090057142
- Publication date Mar 5, 2009
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Hafnium Alloy Target and Process for Producing the Same
- Publication number 20090050475
- Publication date Feb 26, 2009
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Sputtering Target
- Publication number 20090032392
- Publication date Feb 5, 2009
- Nippon Mining & Metals Co., Ltd.
- Hirohito Miyashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Hafnium Alloy Target and Process for Producing the Same
- Publication number 20090000704
- Publication date Jan 1, 2009
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Sputtering Target, Sputtering Target-Backing Plate Assembly and Dep...
- Publication number 20080116066
- Publication date May 22, 2008
- Nippon Mining & Metals Co., Ltd.
- Hirohito Miyashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper or copper alloy target/copper alloy backing plate assembly
- Publication number 20070051624
- Publication date Mar 8, 2007
- Nikko Materials Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Hafnium alloy target and process for producing the same
- Publication number 20060189164
- Publication date Aug 24, 2006
- Nikko Materials Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Target of high-purity nickel or nickel alloy and its producing method
- Publication number 20060137782
- Publication date Jun 29, 2006
- Nikko Materials Co., Ltd.
- Yasuhiro Yamakoshi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper alloy sputtering target and semiconductor element wiring
- Publication number 20050285273
- Publication date Dec 29, 2005
- Nikko Materials Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper alloy sputtering target and method for manufacturing the target
- Publication number 20050121320
- Publication date Jun 9, 2005
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Target of high-purity nickel or nickel alloy and its producing method
- Publication number 20040256035
- Publication date Dec 23, 2004
- Yasuhiro Yamakoshi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electrolytic copper plating method, phosphorous copper anode for el...
- Publication number 20040007474
- Publication date Jan 15, 2004
- Takeo Okabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Tantalum or tungsten target-copper alloy backing plate assembly and...
- Publication number 20030134143
- Publication date Jul 17, 2003
- Kunihiro Oda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputtering target producing few particles, backing plate or sputter...
- Publication number 20030116425
- Publication date Jun 26, 2003
- Takeo Okabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Silicide target for depositing less embrittling gate oxide and meth...
- Publication number 20020179195
- Publication date Dec 5, 2002
- Kunihiro Oda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Hirohito Miyashita

Person

Patents Grantslast 30 patents

Copper alloy sputtering target and semiconductor element wiring

Copper alloy sputtering target and method for manufacturing the target

Sputtering target, sputtering target-backing plate assembly and dep...

Copper or copper alloy target/copper alloy backing plate assembly

Hafnium alloy target

Copper alloy sputtering target and semiconductor element wiring

Hafnium alloy target

Sputtering target

Hafnium alloy target and process for producing the same

Target of high-purity nickel or nickel alloy and its producing method

Target of high-purity nickel or nickel alloy and its producing method

Copper alloy sputtering target and semiconductor element wiring

Hafnium alloy target and process for producing the same

Electrolytic copper plating method, phosphorous copper anode for el...

Sputtering target producing few particles

Sputtering target producing few particles, backing plate or sputter...

Diffusion-joined target assemly of high-purity cobalt target and co...

Tantalum or tungsten target-copper alloy backing plate assembly and...

Silicide target for depositing less embrittling gate oxide and meth...

Tungsten target for sputtering and method for preparing thereof

Sputtering target and method for manufacturing thereof

Patents Applicationslast 30 patents

Copper Alloy Sputtering Target and Semiconductor Element Wiring

Copper Alloy Sputtering Target and Semiconductor Element Wiring

Copper Alloy Sputtering Target and Semiconductor Element Wiring

Hafnium Alloy Target and Process for Producing the Same

Hafnium Alloy Target and Process for Producing the Same

Sputtering Target

Hafnium Alloy Target and Process for Producing the Same

Sputtering Target, Sputtering Target-Backing Plate Assembly and Dep...

Copper or copper alloy target/copper alloy backing plate assembly

Hafnium alloy target and process for producing the same

Target of high-purity nickel or nickel alloy and its producing method

Copper alloy sputtering target and semiconductor element wiring

Copper alloy sputtering target and method for manufacturing the target

Target of high-purity nickel or nickel alloy and its producing method

Electrolytic copper plating method, phosphorous copper anode for el...

Tantalum or tungsten target-copper alloy backing plate assembly and...

Sputtering target producing few particles, backing plate or sputter...

Silicide target for depositing less embrittling gate oxide and meth...