Hiroji Noguchi

Follow

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lead-free solder alloys
- Patent number 6,488,888
- Issue date Dec 3, 2002
- Matsushita Electric Industrial Co., Ltd.
- Toshikazu Murata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder powder and method for preparing the same and solder paste
- Patent number 6,416,590
- Issue date Jul 9, 2002
- Matsushita Electric Industrial Co., Ltd.
- Masahiko Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloys
- Patent number 6,241,942
- Issue date Jun 5, 2001
- Matsushita Electric Industrial Co., Ltd.
- Toshikazu Murata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste
- Patent number 6,159,304
- Issue date Dec 12, 2000
- Matsushita Electric Industrial Co., Ltd.
- Hiroji Noguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Lead-free solder alloys
- Publication number 20020015660
- Publication date Feb 7, 2002
- Toshikazu Murata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR