Hirokazu Aizawa

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and process using dual memorization layer for multi-color sp...
- Patent number 11,380,579
- Issue date Jul 5, 2022
- Tokyo Electron Limited
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for low density silicon oxide for fusion bondi...
- Patent number 11,315,789
- Issue date Apr 26, 2022
- Tokyo Electron Limited
- Kiyotaka Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor back end of line (BEOL) interconnect using multiple m...
- Patent number 10,777,456
- Issue date Sep 15, 2020
- Tokyo Electron Limited
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of protecting low-K layers
- Patent number 10,734,278
- Issue date Aug 4, 2020
- Tokyo Electron Limited
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MIXED ACTIVATING AND REDUCING AGENT FOR BONDING
- Publication number 20240290748
- Publication date Aug 29, 2024
- TOKYO ELECTRON LIMITED
- Christopher NETZBAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Conductive Material Deposition
- Publication number 20240178003
- Publication date May 30, 2024
- TOKYO ELECTRON LIMITED
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGES USING DIELECTRIC ALIGNMEN...
- Publication number 20230343606
- Publication date Oct 26, 2023
- TOKYO ELECTRON LIMITED
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Hard Mask Integration
- Publication number 20230260801
- Publication date Aug 17, 2023
- TOKYO ELECTRON LIMITED
- Angelique Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning with Self-Assembled Monolayer
- Publication number 20230253250
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Dina H. Triyoso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...
- Publication number 20220139776
- Publication date May 5, 2022
- TOKYO ELECTRON LIMITED
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Process Using Dual Memorization Layer for Multi-Color Sp...
- Publication number 20210343586
- Publication date Nov 4, 2021
- TOKYO ELECTRON LIMITED
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Structure for Low Density Silicon Oxide for Fusion Bondi...
- Publication number 20200343092
- Publication date Oct 29, 2020
- TOKYO ELECTRON LIMITED
- Kiyotaka Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BACK END OF LINE (BEOL) INTERCONNECT USING MULTIPLE M...
- Publication number 20200303253
- Publication date Sep 24, 2020
- TOKYO ELECTRON LIMITED
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Protecting Low-K Layers
- Publication number 20190385906
- Publication date Dec 19, 2019
- TOKYO ELECTRON LIMITED
- Hirokazu Aizawa
- H01 - BASIC ELECTRIC ELEMENTS

Hirokazu Aizawa

Person

Patents Grantslast 30 patents

Method and process using dual memorization layer for multi-color sp...

Method and structure for low density silicon oxide for fusion bondi...

Semiconductor back end of line (BEOL) interconnect using multiple m...

Method of protecting low-K layers

Patents Applicationslast 30 patents

MIXED ACTIVATING AND REDUCING AGENT FOR BONDING

Method of Conductive Material Deposition

METHOD FOR FORMING SEMICONDUCTOR PACKAGES USING DIELECTRIC ALIGNMEN...

Metal Hard Mask Integration

Patterning with Self-Assembled Monolayer

METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...

Method and Process Using Dual Memorization Layer for Multi-Color Sp...

Method And Structure for Low Density Silicon Oxide for Fusion Bondi...

SEMICONDUCTOR BACK END OF LINE (BEOL) INTERCONNECT USING MULTIPLE M...

Method of Protecting Low-K Layers