TREA

Hirokazu Honkawa

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  • Ibaraki, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Components placing apparatus
    • Patent number 7,165,318
    • Issue date Jan 23, 2007
    • Matsushita Electric Industrial Co., Ltd.
    • Youichi Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Components placing apparatus
    • Patent number 6,976,304
    • Issue date Dec 20, 2005
    • Matsushita Electric Industrial Co., Ltd.
    • Youichi Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method and apparatus for mounting component
    • Patent number 6,725,532
    • Issue date Apr 27, 2004
    • Matsushita Electric Industrial Co., Ltd.
    • Takeshi Okada
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic component mounting apparatus
    • Patent number 6,178,621
    • Issue date Jan 30, 2001
    • Matsushita Electric Industrial Co., Ltd.
    • Satoshi Shida
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method and apparatus for supporting printed board
    • Patent number 5,850,689
    • Issue date Dec 22, 1998
    • Matsushita Electric Industrial Co., Ltd.
    • Seiichi Mogi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method and apparatus for mounting component
    • Patent number 5,727,311
    • Issue date Mar 17, 1998
    • Matsushita Electric Industrial Co., Ltd.
    • Akiko Ida
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents