Hirokazu Inoue

Person

Toukai, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor module
- Patent number 7,928,587
- Issue date Apr 19, 2011
- Hitachi, Ltd.
- Akihiro Tamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat semiconductor device and power converter employing the same
- Patent number 6,452,261
- Issue date Sep 17, 2002
- Hitachi, Ltd.
- Hironori Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 6,353,258
- Issue date Mar 5, 2002
- Hitachi, Ltd.
- Hirokazu Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit devices including means for reduci...
- Patent number 5,449,948
- Issue date Sep 12, 1995
- Hitachi, Ltd.
- Hirokazu Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for removing an electronic component from a board
- Patent number 5,423,931
- Issue date Jun 13, 1995
- Hitachi, Ltd.
- Hirokazu Inoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts loaded module including thermal stress absorbing p...
- Patent number 5,422,516
- Issue date Jun 6, 1995
- Hitachi, Ltd.
- Takashi Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting substrate
- Patent number 5,350,886
- Issue date Sep 27, 1994
- Hitachi, Ltd.
- Kunio Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor-carrying semiconductor module
- Patent number 5,177,670
- Issue date Jan 5, 1993
- Hitachi, Ltd.
- Hiroichi Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and computer using it
- Patent number 5,097,318
- Issue date Mar 17, 1992
- Hitachi, Ltd.
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and computer using the package
- Patent number 5,095,359
- Issue date Mar 10, 1992
- Hitachi, Ltd.
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Installation structure of integrated circuit devices
- Patent number 5,045,922
- Issue date Sep 3, 1991
- Hitachi, Ltd.
- Hironori Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion of impurities into semiconductor using semi-closed inner...
- Patent number 4,415,385
- Issue date Nov 15, 1983
- Hitachi, Ltd.
- Osamu Saito
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
Power Semiconductor Module
- Publication number 20080258316
- Publication date Oct 23, 2008
- Hitachi, Ltd.
- Akihiro Tamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat semiconductor device and power converter employing the same
- Publication number 20020145188
- Publication date Oct 10, 2002
- Hironori Kodama
- H01 - BASIC ELECTRIC ELEMENTS

Hirokazu Inoue

Person

Patents Grantslast 30 patents

Power semiconductor module

Flat semiconductor device and power converter employing the same

Semiconductor module

Semiconductor integrated circuit devices including means for reduci...

Method and apparatus for removing an electronic component from a board

Electronic parts loaded module including thermal stress absorbing p...

Mounting substrate

Capacitor-carrying semiconductor module

Semiconductor package and computer using it

Semiconductor package and computer using the package

Installation structure of integrated circuit devices

Diffusion of impurities into semiconductor using semi-closed inner...

Patents Applicationslast 30 patents

Power Semiconductor Module

Flat semiconductor device and power converter employing the same