Hirokazu KOMORI

Person

  • Mie, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Wiring module and elastic waterproofing member

    • Patent number 12,142,400
    • Issue date Nov 12, 2024
    • Autonetworks Technologies, Ltd.
    • Hirokazu Komori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring member

    • Patent number 12,128,834
    • Issue date Oct 29, 2024
    • Autonetworks Technologies, Ltd.
    • Hirokazu Komori
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Fixing structure of wiring member, and wiring member with joint member

    • Patent number 12,126,156
    • Issue date Oct 22, 2024
    • Autonetworks Technologies, Ltd.
    • Hirotaka Kato
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Hot melt block, cable manufacturing method, and cable

    • Patent number 12,034,285
    • Issue date Jul 9, 2024
    • Autonetworks Technologies, Ltd.
    • Hirokazu Komori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fluororesin composition, fluororesin sheet, laminate and substrate...

    • Patent number 11,963,297
    • Issue date Apr 16, 2024
    • Daikin Industries, Ltd.
    • Hirokazu Komori
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Resin composition for circuit board, molded body for circuit board,...

    • Patent number 11,939,450
    • Issue date Mar 26, 2024
    • Daikin Industries, Ltd.
    • Hirofumi Mukae
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Molding powder

    • Patent number 11,866,570
    • Issue date Jan 9, 2024
    • Daikin Industries, Ltd.
    • Hirokazu Komori
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Molding powder

    • Patent number 11,555,098
    • Issue date Jan 17, 2023
    • Daikin Industries Ltd.
    • Hirokazu Komori
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Wire cover and connector with wire cover

    • Patent number 11,329,422
    • Issue date May 10, 2022
    • Autonetworks Technologies, Ltd.
    • Hirokazu Komori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Waterproof structure of connector

    • Patent number 11,296,453
    • Issue date Apr 5, 2022
    • AutoNetworks Technologies, Ltd.
    • Hirokazu Komori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multicore cable waterproofing structure

    • Patent number 11,227,704
    • Issue date Jan 18, 2022
    • Autonetworks Technologies, Ltd.
    • Hirokazu Komori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Connector

    • Patent number 11,189,963
    • Issue date Nov 30, 2021
    • AutoNetworks Technologies, Ltd.
    • Naomichi Kawashima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Board connector

    • Patent number 11,165,177
    • Issue date Nov 2, 2021
    • AutoNetworks Technologies, Ltd.
    • Naomichi Kawashima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire harness including branching circuit groups

    • Patent number 10,974,668
    • Issue date Apr 13, 2021
    • Autonetworks Technologies, Ltd.
    • Takahiro Murata
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Board connector

    • Patent number 10,971,841
    • Issue date Apr 6, 2021
    • AutoNetworks Technologies, Ltd.
    • Naomichi Kawashima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit device, method for manufacturing circuit device and connector

    • Patent number 10,973,137
    • Issue date Apr 6, 2021
    • AutoNetworks Technologies, Ltd.
    • Hirokazu Komori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit device

    • Patent number 10,931,046
    • Issue date Feb 23, 2021
    • AutoNetworks Technologies, Ltd.
    • Hirokazu Komori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Cover-equipped connector

    • Patent number 10,855,022
    • Issue date Dec 1, 2020
    • AutoNetworks Technologies, Ltd.
    • Hirokazu Komori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire harness

    • Patent number 10,821,920
    • Issue date Nov 3, 2020
    • Autonetworks Technologies, Ltd.
    • Takahiro Murata
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Wire holding structure

    • Patent number 10,811,818
    • Issue date Oct 20, 2020
    • AutoNetworks Technologies, Ltd.
    • Hirokazu Komori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Holding structure for cable

    • Patent number 10,759,359
    • Issue date Sep 1, 2020
    • Autonetworks Technologies, Ltd.
    • Hirokazu Komori
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Flat cable and waterproof cable

    • Patent number 10,395,796
    • Issue date Aug 27, 2019
    • Autonetworks Technologies, Ltd.
    • Kenta Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Seal structure for multicore cable

    • Patent number 10,355,469
    • Issue date Jul 16, 2019
    • AutoNetworks Technologies, Ltd.
    • Hirokazu Komori
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Seal structure for multicore cable, and rubber plug

    • Patent number 10,298,004
    • Issue date May 21, 2019
    • AutoNetworks Technologies, Ltd.
    • Hirokazu Komori
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Sealing member

    • Patent number 10,236,671
    • Issue date Mar 19, 2019
    • Autonetworks Technologies, Ltd.
    • Hirokazu Komori
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Seal structure for cable, and seal member

    • Patent number 10,148,078
    • Issue date Dec 4, 2018
    • AutoNetworks Technologies, Ltd.
    • Hirokazu Komori
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Seal structure for multi-core cable

    • Patent number 10,003,141
    • Issue date Jun 19, 2018
    • AutoNetworks Technologies, Ltd.
    • Hirokazu Komori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Sealing structure of multicore cable

    • Patent number 9,905,337
    • Issue date Feb 27, 2018
    • AUTONETOWKRS TECHNOLOGIES, LTD.
    • Hirokazu Komori
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Seal member and seal structure for multicore cable

    • Patent number 9,842,671
    • Issue date Dec 12, 2017
    • Autonetworks Technologies, Ltd.
    • Hirokazu Komori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Seal structure for multicore cable, and seal member

    • Patent number 9,837,806
    • Issue date Dec 5, 2017
    • AutoNetworks Technologies, Ltd.
    • Hirokazu Komori
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents