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Hirokazu Matsumoto

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  • Yokohama, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Laser processing method for plate-shaped workpiece
    • Patent number 10,537,967
    • Issue date Jan 21, 2020
    • Disco Corporation
    • Hirokazu Matsumoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 10,276,413
    • Issue date Apr 30, 2019
    • Disco Corporation
    • Chikara Aikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,748,119
    • Issue date Aug 29, 2017
    • Disco Corporation
    • Senichi Ryo
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,620,355
    • Issue date Apr 11, 2017
    • Disco Corporation
    • Senichi Ryo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring structure having interlayer insulating film and wiring line...
    • Patent number 9,543,191
    • Issue date Jan 10, 2017
    • Zeon Corporation
    • Takenao Nemoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Device processing method
    • Patent number 8,258,045
    • Issue date Sep 4, 2012
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing method for semiconductor wafer
    • Patent number 8,252,667
    • Issue date Aug 28, 2012
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Failure recovery method in cluster system
    • Patent number 7,886,181
    • Issue date Feb 8, 2011
    • Hitachi, Ltd.
    • Hirokazu Matsumoto
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Wafer processing method
    • Patent number 7,772,092
    • Issue date Aug 10, 2010
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of manufacturing device
    • Patent number 7,696,067
    • Issue date Apr 13, 2010
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    TELEGRAM ANALYSIS APPARATUS AND TELEGRAM ANALYSIS METHOD
    • Publication number 20180062954
    • Publication date Mar 1, 2018
    • Hitachi, Ltd
    • Takahiro YOKOYAMA
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170032985
    • Publication date Feb 2, 2017
    • Disco Corporation
    • Senichi Ryo
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170025269
    • Publication date Jan 26, 2017
    • Disco Corporation
    • Senichi Ryo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SAW DEVICE MANUFACTURING METHOD
    • Publication number 20160380605
    • Publication date Dec 29, 2016
    • Disco Corporation
    • Hirokazu Matsumoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD FOR PLATE-SHAPED WORKPIECE
    • Publication number 20160184934
    • Publication date Jun 30, 2016
    • Disco Corporation
    • Hirokazu Matsumoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20150283650
    • Publication date Oct 8, 2015
    • Disco Corporation
    • Chikara Aikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR-DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
    • Publication number 20150041983
    • Publication date Feb 12, 2015
    • TOKYO ELECTRON LIMITED
    • Takenao Nemoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICE PROCESSING METHOD
    • Publication number 20100297855
    • Publication date Nov 25, 2010
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD FOR SEMICONDUCTOR WAFER
    • Publication number 20100297830
    • Publication date Nov 25, 2010
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING DEVICE
    • Publication number 20090197395
    • Publication date Aug 6, 2009
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer processing method
    • Publication number 20090191692
    • Publication date Jul 30, 2009
    • DISCO CORPORATION
    • Kentaro IIzuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FAILURE RECOVERY METHOD IN CLUSTER SYSTEM
    • Publication number 20090138757
    • Publication date May 28, 2009
    • Hirokazu Matsumoto
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Cutting tool
    • Publication number 20020178890
    • Publication date Dec 5, 2002
    • Yukio Okuda
    • B24 - GRINDING POLISHING