Hirokazu Miyazaki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Communication characteristic analyzing system, communication charac...
- Patent number 8,995,988
- Issue date Mar 31, 2015
- Softbank BB Corp.
- Kazuhisa Shibayama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mounting structure of semiconductor device and mounting method thereof
- Patent number 6,958,262
- Issue date Oct 25, 2005
- NEC Corporation
- Hirokazu Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure of semiconductor device and mounting method thereof
- Patent number 6,803,647
- Issue date Oct 12, 2004
- NEC Corporation
- Hirokazu Miyazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LSI package structure
- Patent number 6,303,876
- Issue date Oct 16, 2001
- NEC Corporation
- Hirokazu Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting assembly of integrated circuit device and method for produ...
- Patent number 6,297,141
- Issue date Oct 2, 2001
- NEC Corporation
- Hirokazu Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting assembly of integrated circuit device and method for produ...
- Patent number 6,037,665
- Issue date Mar 14, 2000
- NEC Corporation
- Hirokazu Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling system for LSI packages
- Patent number 5,522,452
- Issue date Jun 4, 1996
- NEC Corporation
- Tsukasa Mizuno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMMUNICATION CHARACTERISTIC ANALYZING SYSTEM, COMMUNICATION CHARAC...
- Publication number 20130115961
- Publication date May 9, 2013
- SOFTBANK BB CORP
- Kazuhisa Shibayama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Mounting structure of semiconductor device and mounting method thereof
- Publication number 20040227224
- Publication date Nov 18, 2004
- NEC Corporation
- Hirokazu Miyazaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Mounting structure of semiconductor device and mounting method thereof
- Publication number 20010017425
- Publication date Aug 30, 2001
- NEC Corporation
- Hirokazu Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS

Hirokazu Miyazaki

Person

Patents Grantslast 30 patents

Communication characteristic analyzing system, communication charac...

Mounting structure of semiconductor device and mounting method thereof

Mounting structure of semiconductor device and mounting method thereof

LSI package structure

Mounting assembly of integrated circuit device and method for produ...

Mounting assembly of integrated circuit device and method for produ...

Liquid cooling system for LSI packages

Patents Applicationslast 30 patents

COMMUNICATION CHARACTERISTIC ANALYZING SYSTEM, COMMUNICATION CHARAC...

Mounting structure of semiconductor device and mounting method thereof

Mounting structure of semiconductor device and mounting method thereof