Hirokazu OKADA

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Kyoto-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing resin-encapsulated electronic component, bump-...
- Patent number 9,728,426
- Issue date Aug 8, 2017
- Towa Corporation
- Hirokazu Okada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing electronic component, bump-formed plate-like m...
- Patent number 9,580,827
- Issue date Feb 28, 2017
- Towa Corporation
- Hirokazu Okada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING ELECTRONIC COMPONENT, BUMP-FORMED PLATE-LIKE M...
- Publication number 20160020187
- Publication date Jan 21, 2016
- TOWA CORPORATION
- Hirokazu OKADA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PRODUCING RESIN-ENCAPSULATED ELECTRONIC COMPONENT, BUMP-...
- Publication number 20150311095
- Publication date Oct 29, 2015
- TOWA CORPORATION
- Hirokazu OKADA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR