Hirokazu Saito

Person

Ome, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 10,714,443
- Issue date Jul 14, 2020
- Lapis Semiconductor Co., Ltd.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,121,678
- Issue date Nov 6, 2018
- Renesas Electronics Corporation
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 10,043,773
- Issue date Aug 7, 2018
- Lapis Semiconductor Co., Ltd.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 9,812,417
- Issue date Nov 7, 2017
- Lapis Semiconductor Co., Ltd.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabrication method and semiconductor device
- Patent number 8,835,227
- Issue date Sep 16, 2014
- Lapis Semiconductor Co., Ltd.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible wiring substrate and its manufacturing method
- Patent number 6,479,756
- Issue date Nov 12, 2002
- Casio Computer Co., Ltd.
- Hirokazu Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal structure to which an electronic component is to be bonded
- Patent number 6,437,253
- Issue date Aug 20, 2002
- Casio Computer Co., Ltd.
- Hirokazu Saito
- G02 - OPTICS
Information Patent Grant
Method of manufacturing flexible wiring board
- Patent number 6,433,414
- Issue date Aug 13, 2002
- Casio Computer Co., Ltd.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroluminescent panel-attached electronic device
- Patent number 6,346,973
- Issue date Feb 12, 2002
- Casio Computer Co., Ltd.
- Masaaki Shibamoto
- G02 - OPTICS
Information Patent Grant
Flexible wiring substrate and its manufacturing method
- Patent number 6,320,135
- Issue date Nov 20, 2001
- Casio Computer Co., Ltd.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal display device having an IC chip mounted on a narrow...
- Patent number 6,300,997
- Issue date Oct 9, 2001
- Casio Computer Co., Ltd.
- Hirokazu Saito
- G02 - OPTICS
Information Patent Grant
LCD with electroluminescent panel drive circuitry mounted to oppose...
- Patent number 5,847,783
- Issue date Dec 8, 1998
- Casio Computer Co., Ltd.
- Masami Hiramoto
- G02 - OPTICS
Information Patent Grant
Memory Assembly
- Patent number 5,440,451
- Issue date Aug 8, 1995
- Casio Computer Co., Ltd.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180315726
- Publication date Nov 1, 2018
- LAPIS SEMICONDUCTOR CO., LTD.
- HIROKAZU SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180061664
- Publication date Mar 1, 2018
- RENESAS ELECTRONICS CORPORATION
- Hirokazu SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180040579
- Publication date Feb 8, 2018
- LAPIS SEMICONDUCTOR CO., LTD.
- HIROKAZU SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20170092610
- Publication date Mar 30, 2017
- LAPIS SEMICONDUCTOR CO., LTD.
- HIROKAZU SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20120306068
- Publication date Dec 6, 2012
- LAPIS Semiconductor Co., Ltd.
- Hirokazu SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible wiring substrate and its manufacturing method
- Publication number 20020048156
- Publication date Apr 25, 2002
- CASIO COMPUTER CO., LTD.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible wiring board, method of manufacturing flexible wiring boar...
- Publication number 20010009299
- Publication date Jul 26, 2001
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS

Hirokazu Saito

Person

Patents Grantslast 30 patents

Semiconductor device and semiconductor device manufacturing method

Method of manufacturing semiconductor device

Semiconductor device and semiconductor device manufacturing method

Semiconductor device and semiconductor device manufacturing method

Semiconductor device fabrication method and semiconductor device

Flexible wiring substrate and its manufacturing method

Terminal structure to which an electronic component is to be bonded

Method of manufacturing flexible wiring board

Electroluminescent panel-attached electronic device

Flexible wiring substrate and its manufacturing method

Liquid crystal display device having an IC chip mounted on a narrow...

LCD with electroluminescent panel drive circuitry mounted to oppose...

Memory Assembly

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE FABRICATION METHOD AND SEMICONDUCTOR DEVICE

Flexible wiring substrate and its manufacturing method

Flexible wiring board, method of manufacturing flexible wiring boar...