Hirokazu Yokoyama

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for inspecting defects
- Patent number 7,002,674
- Issue date Feb 21, 2006
- Sumitomo Mitsubishi Silicon Corporation
- Hirokazu Yokoyama
- G01 - MEASURING TESTING
Information Patent Grant
Defect inspection method and defect inspection apparatus
- Patent number 6,779,159
- Issue date Aug 17, 2004
- Sumitomo Mitsubishi Silicon Corporation
- Hirokazu Yokoyama
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method and apparatus for inspecting defects
- Publication number 20030227620
- Publication date Dec 11, 2003
- SUMITOMO MITSUBISHI SILICON CORPORATION
- Hirokazu Yokoyama
- G01 - MEASURING TESTING
Information Patent Application
Defect inspection method and defect inspection apparatus
- Publication number 20020188917
- Publication date Dec 12, 2002
- SUMITOMO MITSUBISHI SILICON CORPORATION
- Hirokazu Yokoyama
- G01 - MEASURING TESTING