Hiroki HORIGOME

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat-curable resin composition and uses thereof
- Patent number 11,639,410
- Issue date May 2, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroki Horigome
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20240263004
- Publication date Aug 8, 2024
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR ELEMENT ENCAPSULATION RESIN COMPOSITION AND SEMICONDU...
- Publication number 20240239988
- Publication date Jul 18, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroki HORIGOME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED S...
- Publication number 20230399467
- Publication date Dec 14, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroki HORIGOME
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20230312909
- Publication date Oct 5, 2023
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20220372274
- Publication date Nov 24, 2022
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF
- Publication number 20210189043
- Publication date Jun 24, 2021
- Shin-Etsu Chemical Co., Ltd.
- Hiroki HORIGOME
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hiroki HORIGOME

Person

Patents Grantslast 30 patents

Heat-curable resin composition and uses thereof

Patents Applicationslast 30 patents

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR ELEMENT ENCAPSULATION RESIN COMPOSITION AND SEMICONDU...

RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED S...

THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF