Hiroki HOSAKA

Person

Nirasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Test device, change kit, and method of exchanging change kit
- Patent number 12,106,997
- Issue date Oct 1, 2024
- Tokyo Electron Limited
- Hiroki Hosaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer inspection apparatus
- Patent number 11,515,175
- Issue date Nov 29, 2022
- Tokyo Electron Limited
- Shuji Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection apparatus
- Patent number 11,486,924
- Issue date Nov 1, 2022
- Tokyo Electron Limited
- Hiroki Hosaka
- G01 - MEASURING TESTING
Information Patent Grant
Transfer method and inspection system
- Patent number 10,006,961
- Issue date Jun 26, 2018
- Tokyo Electron Limited
- Hiroki Hosaka
- G01 - MEASURING TESTING
Information Patent Grant
Probing apparatus and probing method
- Patent number 8,310,261
- Issue date Nov 13, 2012
- Tokyo Electron Limited
- Hiroki Hosaka
- G01 - MEASURING TESTING
Information Patent Grant
Processing apparatus
- Patent number 7,887,280
- Issue date Feb 15, 2011
- Tokyo Electron Limited
- Hiroki Hosaka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer carrying-in/out apparatus
- Patent number D607424
- Issue date Jan 5, 2010
- Tokyo Electron Limited
- Hiroki Hosaka
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Wafer carrying-in/out apparatus
- Patent number D602882
- Issue date Oct 27, 2009
- Tokyo Electron Limited
- Hiroki Hosaka
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Probing apparatus and probing method
- Patent number 7,583,096
- Issue date Sep 1, 2009
- Tokyo Electron Limited
- Hiroki Hosaka
- G01 - MEASURING TESTING
Information Patent Grant
Wafer carrying-in/out machine
- Patent number D592230
- Issue date May 12, 2009
- Tokyo Electron Limited
- Hiroki Hosaka
- D15 - Machines not elsewhere specified
Information Patent Grant
Substrate transfer apparatus and method, and storage medium
- Patent number 7,458,469
- Issue date Dec 2, 2008
- Tokyo Electron Limited
- Hiroki Hosaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conveyance method for transporting objects
- Patent number 7,457,680
- Issue date Nov 25, 2008
- Tokyo Electron Limited
- Shuji Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer delivery apparatus
- Patent number D571739
- Issue date Jun 24, 2008
- Tokyo Electron Limited
- Hiroki Hosaka
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor wafer delivery apparatus
- Patent number D571740
- Issue date Jun 24, 2008
- Tokyo Electron Limited
- Hiroki Hosaka
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor wafer delivery apparatus
- Patent number D568837
- Issue date May 13, 2008
- Tokyo Electron Limited
- Hiroki Hosaka
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Pair of stage arms for a semiconductor wafer delivery apparatus
- Patent number D559806
- Issue date Jan 15, 2008
- Tokyo Electron Limited
- Hiroki Hosaka
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Stage arm for a semiconductor wafer delivery apparatus
- Patent number D559805
- Issue date Jan 15, 2008
- Tokyo Electron Limited
- Hiroki Hosaka
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Work convey system, unmanned convey vehicle system, unmanned convey...
- Patent number 7,283,890
- Issue date Oct 16, 2007
- Tokyo Electron Limited
- Toshihiko Iijima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Centering mechanism, centering unit, semiconductor manufacturing ap...
- Patent number 7,153,087
- Issue date Dec 26, 2006
- Samsung Electronics Co., Ltd.
- Ki Sang Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for testing semiconductor device
- Patent number 5,801,527
- Issue date Sep 1, 1998
- Tokyo Electron Limited
- Takao Ishii
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
TEST DEVICE, CHANGE KIT, AND METHOD OF EXCHANGING CHANGE KIT
- Publication number 20220172978
- Publication date Jun 2, 2022
- TOKYO ELECTRON LIMITED
- Hiroki HOSAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION APPARATUS
- Publication number 20210278456
- Publication date Sep 9, 2021
- TOKYO ELECTRON LIMITED
- Hiroki HOSAKA
- G01 - MEASURING TESTING
Information Patent Application
WAFER INSPECTION APPARATUS
- Publication number 20200168481
- Publication date May 28, 2020
- TOKYO ELECTRON LIMITED
- Shuji AKIYAMA
- F24 - HEATING RANGES VENTILATING
Information Patent Application
TRANSFER METHOD AND INSPECTION SYSTEM
- Publication number 20160091562
- Publication date Mar 31, 2016
- TOKYO ELECTRON LIMITED
- Hiroki HOSAKA
- G01 - MEASURING TESTING
Information Patent Application
WAFER TRANSFER DEVICE
- Publication number 20130195587
- Publication date Aug 1, 2013
- TOKYO ELECTRON LIMITED
- Hiroki HOSAKA
- G01 - MEASURING TESTING
Information Patent Application
PROBING APPARATUS AND PROBING METHOD
- Publication number 20090267626
- Publication date Oct 29, 2009
- TOKYO ELECTRON LIMITED
- Hiroki HOSAKA
- G01 - MEASURING TESTING
Information Patent Application
PROCESSING APPARATUS
- Publication number 20070264104
- Publication date Nov 15, 2007
- TOKYO ELECTRON LIMITED
- Hiroki HOSAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBING APPARATUS AND PROBING METHOD
- Publication number 20070262783
- Publication date Nov 15, 2007
- TOKYO ELECTRON LIMITED
- Hiroki HOSAKA
- G01 - MEASURING TESTING
Information Patent Application
CONVEYANCE METHOD FOR TRANSPORTING OBJECTS
- Publication number 20070150085
- Publication date Jun 28, 2007
- Shuji Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate transfer apparatus and method, and storage medium
- Publication number 20070031222
- Publication date Feb 8, 2007
- TOKYO ELECTRON LIMITED
- Hiroki Hosaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conveyance system, conveyance method and vacuum holding apparatus f...
- Publication number 20050209725
- Publication date Sep 22, 2005
- Shuji Akiyama
- G05 - CONTROLLING REGULATING
Information Patent Application
Work convey system, unmanned coney vehicle system, unmanned convey...
- Publication number 20040234362
- Publication date Nov 25, 2004
- Toshihiko Iijima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Conveyance system, conveyance method and vacuum holding apparatus f...
- Publication number 20040046545
- Publication date Mar 11, 2004
- Shuji Akiyama
- G05 - CONTROLLING REGULATING
Information Patent Application
Centering mechanism, centering unit, semiconductor manufacturing ap...
- Publication number 20030160401
- Publication date Aug 28, 2003
- Ki Sang Kang
- H01 - BASIC ELECTRIC ELEMENTS

Hiroki HOSAKA

Person

Patents Grantslast 30 patents

Test device, change kit, and method of exchanging change kit

Wafer inspection apparatus

Inspection apparatus

Transfer method and inspection system

Probing apparatus and probing method

Processing apparatus

Wafer carrying-in/out apparatus

Wafer carrying-in/out apparatus

Probing apparatus and probing method

Wafer carrying-in/out machine

Substrate transfer apparatus and method, and storage medium

Conveyance method for transporting objects

Semiconductor wafer delivery apparatus

Semiconductor wafer delivery apparatus

Semiconductor wafer delivery apparatus

Pair of stage arms for a semiconductor wafer delivery apparatus

Stage arm for a semiconductor wafer delivery apparatus

Work convey system, unmanned convey vehicle system, unmanned convey...

Centering mechanism, centering unit, semiconductor manufacturing ap...

Apparatus and method for testing semiconductor device

Patents Applicationslast 30 patents

TEST DEVICE, CHANGE KIT, AND METHOD OF EXCHANGING CHANGE KIT

INSPECTION APPARATUS

WAFER INSPECTION APPARATUS

TRANSFER METHOD AND INSPECTION SYSTEM

WAFER TRANSFER DEVICE

PROBING APPARATUS AND PROBING METHOD

PROCESSING APPARATUS

PROBING APPARATUS AND PROBING METHOD

CONVEYANCE METHOD FOR TRANSPORTING OBJECTS

Substrate transfer apparatus and method, and storage medium

Conveyance system, conveyance method and vacuum holding apparatus f...

Work convey system, unmanned coney vehicle system, unmanned convey...

Conveyance system, conveyance method and vacuum holding apparatus f...

Centering mechanism, centering unit, semiconductor manufacturing ap...