Hiroki Nezu

Person

  • Tokyo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Process for forming multilayer wiring

    • Patent number 5,670,421
    • Issue date Sep 23, 1997
    • Hitachi, Ltd.
    • Eisuke Nishitani
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Process for forming multilayer wiring

    • Patent number 5,498,768
    • Issue date Mar 12, 1996
    • Hitachi, Ltd.
    • Eisuke Nishitani
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...