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Hiroki Nezu
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Tokyo, JP
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last 30 patents
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Patent Grant
Process for forming multilayer wiring
Patent number
5,670,421
Issue date
Sep 23, 1997
Hitachi, Ltd.
Eisuke Nishitani
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Process for forming multilayer wiring
Patent number
5,498,768
Issue date
Mar 12, 1996
Hitachi, Ltd.
Eisuke Nishitani
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...