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Hiroki Okada

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  • Suwon-si, KR
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Patents Grantslast 30 patents

  • Information Patent Grant

    Multilayer electronic component
    • Patent number 12,272,497
    • Issue date Apr 8, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Hee Jung Jung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of manufacturing printed circuit board
    • Patent number 12,016,130
    • Issue date Jun 18, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Chan Jin Park
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Printed circuit board
    • Patent number 11,770,894
    • Issue date Sep 26, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Hiroki Okada
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed circuit board
    • Patent number 11,122,679
    • Issue date Sep 14, 2021
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Hiroki Okada
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20240331946
    • Publication date Oct 3, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chung Yeol LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20240312714
    • Publication date Sep 19, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Chung Yeol LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
    • Publication number 20240298411
    • Publication date Sep 5, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chan Jin Park
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20240212936
    • Publication date Jun 27, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Hee Jung Jung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20240212935
    • Publication date Jun 27, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Hiroki OKADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
    • Publication number 20220386473
    • Publication date Dec 1, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Chan Jin Park
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20220030704
    • Publication date Jan 27, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Hiroki Okada
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20210212198
    • Publication date Jul 8, 2021
    • Samsung Electro-Mechanics Co., Ltd.
    • Hiroki Okada
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR