Hiroki Oshima

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High Wycombe, GB

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Patents Grantslast 30 patents

Information Patent Grant
Solder ball supplying method, solder ball supplying device, and sol...
- Patent number 10,722,965
- Issue date Jul 28, 2020
- Senju Metal Industry Co., Ltd.
- Kaichi Tsuruta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder transfer sheet, solder bump, and solder precoating method us...
- Patent number 10,111,342
- Issue date Oct 23, 2018
- Senju Metal Industry Co., Ltd.
- Kaichi Tsuruta
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Solder Transfer Sheet, Solder Bump, and Solder Precoating Method Us...
- Publication number 20170354042
- Publication date Dec 7, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Kaichi Tsuruta
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Solder Ball Supplying Method, Solder Ball Supplying Device, and Sol...
- Publication number 20160271715
- Publication date Sep 22, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Kaichi Tsuruta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR