Hiroki Oshima

Person

Tochigi-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder ball, solder joint, and joining method
- Patent number 10,780,530
- Issue date Sep 22, 2020
- Senju Metal Industry Co., Ltd.
- Hiroki Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered solder material for bonding different species of electrodes...
- Patent number 9,669,493
- Issue date Jun 6, 2017
- Senju Metal Industry Co., Ltd.
- Koji Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE MATERIAL PASTE FOR NON-AQUEOUS ELECTROLYTE SOLUTION SECO...
- Publication number 20240429394
- Publication date Dec 26, 2024
- ZEON CORPORATION
- Hiroki OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MATERIAL PASTE FOR NON-AQUEOUS ELECTROLYTE SOLUTION SECO...
- Publication number 20240332519
- Publication date Oct 3, 2024
- ZEON CORPORATION
- Hiroki OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BINDER COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY ELECTRODE, SLU...
- Publication number 20240021824
- Publication date Jan 18, 2024
- ZEON CORPORATION
- Hiroki OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BINDER COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY ELECTRODE AND...
- Publication number 20230282832
- Publication date Sep 7, 2023
- ZEON CORPORATION
- Taku MATSUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BINDER COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY, SLURRY COMPOS...
- Publication number 20230133447
- Publication date May 4, 2023
- ZEON CORPORATION
- Hiroki OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BINDER COMPOSITION FOR SECONDARY BATTERY, SLURRY COMPOSITION FOR SE...
- Publication number 20220336815
- Publication date Oct 20, 2022
- ZEON CORPORATION
- Hiroki OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball, Solder Joint, and Joining Method
- Publication number 20190358752
- Publication date Nov 28, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Hiroki Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENGINE CONTROL DEVICE
- Publication number 20190003408
- Publication date Jan 3, 2019
- MITSUBISHI JIDOSHA KOGYO KABUSHIKI KAISHA
- Koji HATA
- B60 - VEHICLES IN GENERAL
Information Patent Application
SOLDER TRANSFER SHEET
- Publication number 20160250719
- Publication date Sep 1, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Kaichi Tsuruta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED SOLDER MATERIAL FOR BONDING DISSIMILAR ELECTRODES, AND METH...
- Publication number 20150314396
- Publication date Nov 5, 2015
- SENJU METAL INDUSTRY CO., LTD
- Koji WATANABE
- B32 - LAYERED PRODUCTS

Hiroki Oshima

Person

Patents Grantslast 30 patents

Solder ball, solder joint, and joining method

Layered solder material for bonding different species of electrodes...

Patents Applicationslast 30 patents

CONDUCTIVE MATERIAL PASTE FOR NON-AQUEOUS ELECTROLYTE SOLUTION SECO...

CONDUCTIVE MATERIAL PASTE FOR NON-AQUEOUS ELECTROLYTE SOLUTION SECO...

BINDER COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY ELECTRODE, SLU...

BINDER COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY ELECTRODE AND...

BINDER COMPOSITION FOR NON-AQUEOUS SECONDARY BATTERY, SLURRY COMPOS...

BINDER COMPOSITION FOR SECONDARY BATTERY, SLURRY COMPOSITION FOR SE...

Solder Ball, Solder Joint, and Joining Method

ENGINE CONTROL DEVICE

SOLDER TRANSFER SHEET

LAYERED SOLDER MATERIAL FOR BONDING DISSIMILAR ELECTRODES, AND METH...