Hiroki Sudo

Person

Tochigi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder alloy, solder ball, solder paste, and solder joint
- Patent number 12,109,653
- Issue date Oct 8, 2024
- Senju Metal Industry Co., Ltd.
- Takahiro Matsufuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Secret survival data processing system, secret survival data proces...
- Patent number 12,095,906
- Issue date Sep 17, 2024
- Nippon Telegraph and Telephone Corporation
- Atsunori Ichikawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Core material, electronic component and method for forming bump ele...
- Patent number 11,872,656
- Issue date Jan 16, 2024
- Senju Metal Industry Co., Ltd.
- Shigeki Kondoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming bump electrode substrate
- Patent number 11,478,869
- Issue date Oct 25, 2022
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material, solder paste, and solder joint
- Patent number 11,344,976
- Issue date May 31, 2022
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu core ball, solder joint, solder paste and formed solder
- Patent number 10,888,959
- Issue date Jan 12, 2021
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu core ball, solder joint, solder paste and formed solder
- Patent number 10,639,749
- Issue date May 5, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Flux composition for solder applications
- Patent number 10,610,979
- Issue date Apr 7, 2020
- Senju Metal Industry Co., Ltd.
- Daisuke Maruko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Solder Alloy, Solder Ball, Solder Paste, and Solder Joint
- Publication number 20240424615
- Publication date Dec 26, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Matsufuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SECURE COMPUTATION APPARATUS, SECURE COMPUTATION SYSTEM, SECURE COM...
- Publication number 20240273219
- Publication date Aug 15, 2024
- Nippon Telegraph and Telephone Corporation
- Hiroki SUDO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SECURE COMPUTATION APPARATUS, SECURE COMPUTATION SYSTEM, SECURE COM...
- Publication number 20240273180
- Publication date Aug 15, 2024
- Nippon Telegraph and Telephone Corporation
- Hiroki SUDO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SECURE RELATIONAL ALGEBRAIC OPERATION SYSTEM, SECURE COMPUTATION AP...
- Publication number 20240061904
- Publication date Feb 22, 2024
- Nippon Telegraph and Telephone Corporation
- Hiroki SUDO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Solder Alloy, Solder Ball, Solder Paste, and Solder Joint
- Publication number 20240024990
- Publication date Jan 25, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Matsufuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Ar...
- Publication number 20230173619
- Publication date Jun 8, 2023
- SENJU METAL INDUSTRY CO., LTD.
- Takashi Saito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTATION APPARATUS, METHOD AND PROGRAM FOR THE SAME
- Publication number 20220413802
- Publication date Dec 29, 2022
- Nippon Telegraph and Telephone Corporation
- Hiroki SUDO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SECRET SURVIVAL DATA PROCESSING SYSTEM, SECRET SURVIVAL DATA PROCES...
- Publication number 20220360431
- Publication date Nov 10, 2022
- Nippon Telegraph and Telephone Corporation
- Atsunori ICHIKAWA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...
- Publication number 20220212294
- Publication date Jul 7, 2022
- SENJU METAL INDUSTRY CO., LTD.
- Shigeki KONDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING BUMP ELECTRODE SUBSTRATE
- Publication number 20210387276
- Publication date Dec 16, 2021
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro HATTORI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL, SOLDER PASTE, AND SOLDER JOINT
- Publication number 20200376607
- Publication date Dec 3, 2020
- SENJU METAL INDUSTRY CO., LTD.,
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
- Publication number 20190375054
- Publication date Dec 12, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
- Publication number 20190376161
- Publication date Dec 12, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
- Publication number 20190375053
- Publication date Dec 12, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Flux
- Publication number 20180339375
- Publication date Nov 29, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Daisuke Maruko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Hiroki Sudo

Person

Patents Grantslast 30 patents

Solder alloy, solder ball, solder paste, and solder joint

Secret survival data processing system, secret survival data proces...

Core material, electronic component and method for forming bump ele...

Method for forming bump electrode substrate

Solder material, solder paste, and solder joint

Cu core ball, solder joint, solder paste and formed solder

Cu core ball, solder joint, solder paste and formed solder

Flux composition for solder applications

Patents Applicationslast 30 patents

Solder Alloy, Solder Ball, Solder Paste, and Solder Joint

SECURE COMPUTATION APPARATUS, SECURE COMPUTATION SYSTEM, SECURE COM...

SECURE COMPUTATION APPARATUS, SECURE COMPUTATION SYSTEM, SECURE COM...

SECURE RELATIONAL ALGEBRAIC OPERATION SYSTEM, SECURE COMPUTATION AP...

Solder Alloy, Solder Ball, Solder Paste, and Solder Joint

Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Ar...

COMPUTATION APPARATUS, METHOD AND PROGRAM FOR THE SAME

SECRET SURVIVAL DATA PROCESSING SYSTEM, SECRET SURVIVAL DATA PROCES...

CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...

METHOD FOR FORMING BUMP ELECTRODE SUBSTRATE

SOLDER MATERIAL, SOLDER PASTE, AND SOLDER JOINT

Cu Core Ball, Solder Joint, Solder Paste and Formed Solder

Cu Core Ball, Solder Joint, Solder Paste and Formed Solder

Cu Core Ball, Solder Joint, Solder Paste and Formed Solder

Flux