Hiroki YAMADA

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Miyagi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,154,790
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Seiichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and substrate processing apparatus
- Patent number 11,121,000
- Issue date Sep 14, 2021
- Tokyo Electron Limited
- Seiichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20240254626
- Publication date Aug 1, 2024
- Tokyo Electron Limited
- Hiroki YAMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240120183
- Publication date Apr 11, 2024
- Tokyo Electron Limited
- Makoto WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230080956
- Publication date Mar 16, 2023
- TOKYO ELECTRON LIMITED
- Makoto WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20220262601
- Publication date Aug 18, 2022
- TOKYO ELECTRON LIMITED
- Seiichi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20210043461
- Publication date Feb 11, 2021
- TOKYO ELECTRON LIMITED
- Seiichi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS