Hiroko Koike

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitor, circuit board, method of formation of capacitor, and met...
- Patent number 7,176,052
- Issue date Feb 13, 2007
- Shinko Electric Industries Co., Ltd.
- Hiroko Koike
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate-embedded capacitor, production method thereof, and circui...
- Patent number 7,078,311
- Issue date Jul 18, 2006
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal, semiconductor device, terminal forming method and flip ch...
- Patent number 7,019,405
- Issue date Mar 28, 2006
- Shinko Electric Industries Co., Ltd.
- Hiroko Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-embedded capacitor, production method thereof, and circui...
- Patent number 6,903,917
- Issue date Jun 7, 2005
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of formation of a capacitor with a solid electrolyte layer c...
- Patent number 6,890,792
- Issue date May 10, 2005
- Shinko Electric Industries Co., Ltd.
- Hiroko Koike
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a carbon fiber reinforced resin as a he...
- Patent number 6,864,120
- Issue date Mar 8, 2005
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method thereof
- Patent number 6,861,284
- Issue date Mar 1, 2005
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a carbon fiber reinforced resin as a he...
- Patent number 6,713,863
- Issue date Mar 30, 2004
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device module and a part thereof
- Patent number 6,586,845
- Issue date Jul 1, 2003
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process of producing same
- Patent number 6,548,326
- Issue date Apr 15, 2003
- Shinko Electronic Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process of producing same
- Patent number 6,420,787
- Issue date Jul 16, 2002
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,404,070
- Issue date Jun 11, 2002
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- D03 - WEAVING
Information Patent Grant
Apparatus for positioning a thin plate
- Patent number 6,354,480
- Issue date Mar 12, 2002
- Shinko Electric Industries, Co., Ltd.
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Capacitor, circuit board, method of formation of capacitor, and met...
- Publication number 20050144767
- Publication date Jul 7, 2005
- Shinko Electric Industries Co., Ltd.
- Hiroko Koike
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and production method thereof
- Publication number 20040262735
- Publication date Dec 30, 2004
- Mitsutoshi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor, circuit board, method of formation of capacitor, and met...
- Publication number 20040171214
- Publication date Sep 2, 2004
- Shinko Electric Industries Co., Ltd.
- Hiroko Koike
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having a carbon fiber reinforced resin as a he...
- Publication number 20040166609
- Publication date Aug 26, 2004
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate-embedded capacitor, production method thereof, and circui...
- Publication number 20040137695
- Publication date Jul 15, 2004
- Mitsutoshi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate-embedded capacitor, production method thereof, and circui...
- Publication number 20030223177
- Publication date Dec 4, 2003
- Mitsutoshi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Terminal, semiconductor device, terminal forming method and flip ch...
- Publication number 20030222326
- Publication date Dec 4, 2003
- Hiroko Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and production method thereof
- Publication number 20030102547
- Publication date Jun 5, 2003
- Mitsutoshi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat radiation fin using a carbon fiber reinforced resin as heat ra...
- Publication number 20030102117
- Publication date Jun 5, 2003
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat radiation fin using a carbon fiber reinforced resin as heat ra...
- Publication number 20020062946
- Publication date May 30, 2002
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process of producing same
- Publication number 20020041037
- Publication date Apr 11, 2002
- Shinko Electronic Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for positioning a thin plate
- Publication number 20010013532
- Publication date Aug 16, 2001
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a carbon fiber reinforced resin as a he...
- Publication number 20010009302
- Publication date Jul 26, 2001
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and production method thereof
- Publication number 20010004130
- Publication date Jun 21, 2001
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS

Hiroko Koike

Person

Patents Grantslast 30 patents

Capacitor, circuit board, method of formation of capacitor, and met...

Substrate-embedded capacitor, production method thereof, and circui...

Terminal, semiconductor device, terminal forming method and flip ch...

Substrate-embedded capacitor, production method thereof, and circui...

Method of formation of a capacitor with a solid electrolyte layer c...

Semiconductor device having a carbon fiber reinforced resin as a he...

Semiconductor device and production method thereof

Semiconductor device having a carbon fiber reinforced resin as a he...

Semiconductor device module and a part thereof

Semiconductor device and process of producing same

Semiconductor device and process of producing same

Semiconductor device

Apparatus for positioning a thin plate

Patents Applicationslast 30 patents

Capacitor, circuit board, method of formation of capacitor, and met...

Semiconductor device and production method thereof

Capacitor, circuit board, method of formation of capacitor, and met...

Semiconductor device having a carbon fiber reinforced resin as a he...

Substrate-embedded capacitor, production method thereof, and circui...

Substrate-embedded capacitor, production method thereof, and circui...

Terminal, semiconductor device, terminal forming method and flip ch...

Semiconductor device and production method thereof

Heat radiation fin using a carbon fiber reinforced resin as heat ra...

Heat radiation fin using a carbon fiber reinforced resin as heat ra...

Semiconductor device and process of producing same

Apparatus for positioning a thin plate

Semiconductor device having a carbon fiber reinforced resin as a he...

Semiconductor device and production method thereof