Hiroko Ota

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Ooaza-awasa, Kosyoku-shi, Nagano-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonded wafer and method of manufacturing it
- Patent number 5,340,435
- Issue date Aug 23, 1994
- Yatsuo Ito
- H01 - BASIC ELECTRIC ELEMENTS