Hiromasa Miyoshi

Person

Okayama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Joining material and joining method using same
- Patent number 11,453,053
- Issue date Sep 27, 2022
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,543,569
- Issue date Jan 28, 2020
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,328,534
- Issue date Jun 25, 2019
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Fine silver particle dispersing solution
- Patent number 9,914,845
- Issue date Mar 13, 2018
- Dowa Electronics Materials Co., Ltd.
- Takashi Hinotsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal nanoparticle dispersion, method for producing metal nanoparti...
- Patent number 9,662,748
- Issue date May 30, 2017
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-temperature sintered silver nanoparticle composition and electr...
- Patent number 8,673,049
- Issue date Mar 18, 2014
- Dowa Electronics Materials Co., Ltd.
- Gregory A. Jablonski
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Copper particle clusters and powder containing the same suitable as...
- Patent number 7,235,119
- Issue date Jun 26, 2007
- Dowa Mining Co., Ltd.
- Kazushi Sano
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper particle clusters and powder containing the same suitable as...
- Patent number 6,923,924
- Issue date Aug 2, 2005
- Dowa Mining Co., Ltd.
- Kazushi Sano
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper powder for electrically conductive paste
- Patent number 6,881,240
- Issue date Apr 19, 2005
- Dowa Mining Co., Ltd.
- Kazushi Sano
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper powder and process for producing copper powder
- Patent number 6,875,252
- Issue date Apr 5, 2005
- Dowa Mining Co., Ltd.
- Kazushi Sano
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper particle clusters and powder containing the same suitable as...
- Patent number 6,620,344
- Issue date Sep 16, 2003
- Dowa Mining Co., Ltd.
- Kazushi Sano
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
JOINING MATERIAL AND JOINING METHOD USING SAME
- Publication number 20190118257
- Publication date Apr 25, 2019
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET
- Publication number 20180331063
- Publication date Nov 15, 2018
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20170252874
- Publication date Sep 7, 2017
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20170120395
- Publication date May 4, 2017
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20170077057
- Publication date Mar 16, 2017
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINE SILVER PARTICLE DISPERSING SOLUTION
- Publication number 20160297982
- Publication date Oct 13, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Takashi Hinotsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...
- Publication number 20160254243
- Publication date Sep 1, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20160136763
- Publication date May 19, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE FOR JOINING, JOINING METHOD AND JOINED BODY
- Publication number 20160121435
- Publication date May 5, 2016
- Toyota Jidosha Kabushiki Kaisha
- Masashi FURUKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL NANOPARTICLE DISPERSION, METHOD FOR PRODUCING METAL NANOPARTI...
- Publication number 20160101486
- Publication date Apr 14, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi ENDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-TEMPERATURE SINTERED SILVER NANOPARTICLE COMPOSITION AND ELECTR...
- Publication number 20120177897
- Publication date Jul 12, 2012
- PCHEM ASSOCIATES, INC.,
- Gregory A. Jablonski
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper particle clusters and powder containing the same suitable as...
- Publication number 20050161643
- Publication date Jul 28, 2005
- DOWA MINING CO., LTD.
- Kazushi Sano
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Copper particle clusters and powder containing the same suitable as...
- Publication number 20040026669
- Publication date Feb 12, 2004
- DOWA MINING CO., LTD.
- Kazushi Sano
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Copper powder for electrically conductive paste
- Publication number 20030089199
- Publication date May 15, 2003
- Kazushi Sano
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Copper powder and process for producing copper powder
- Publication number 20030015062
- Publication date Jan 23, 2003
- DOWA MINING CO., LTD.
- Kazushi Sano
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Silver-dispersed copper powder, process for producing the powder an...
- Publication number 20020117652
- Publication date Aug 29, 2002
- DOWA MINING CO., LTD.
- Kazushi Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper particle clusters and powder containing the same suitable as...
- Publication number 20010003362
- Publication date Jun 14, 2001
- DOW A MINING CO., LTD.
- Kazushi Sano
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Copper powder and process for producing copper powder
- Publication number 20010002558
- Publication date Jun 7, 2001
- DOWA MINING CO., LTD.
- Kazushi Sano
- B22 - CASTING POWDER METALLURGY

Hiromasa Miyoshi

Person

Patents Grantslast 30 patents

Joining material and joining method using same

Bonding material and bonding method using same

Bonding material and bonding method using same

Fine silver particle dispersing solution

Metal nanoparticle dispersion, method for producing metal nanoparti...

Low-temperature sintered silver nanoparticle composition and electr...

Copper particle clusters and powder containing the same suitable as...

Copper particle clusters and powder containing the same suitable as...

Copper powder for electrically conductive paste

Copper powder and process for producing copper powder

Copper particle clusters and powder containing the same suitable as...

Patents Applicationslast 30 patents

JOINING MATERIAL AND JOINING METHOD USING SAME

METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET

BONDING MATERIAL AND BONDING METHOD USING SAME

BONDING MATERIAL AND BONDING METHOD USING SAME

BONDING MATERIAL AND BONDING METHOD USING SAME

FINE SILVER PARTICLE DISPERSING SOLUTION

JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...

BONDING MATERIAL AND BONDING METHOD USING SAME

METAL PASTE FOR JOINING, JOINING METHOD AND JOINED BODY

METAL NANOPARTICLE DISPERSION, METHOD FOR PRODUCING METAL NANOPARTI...

LOW-TEMPERATURE SINTERED SILVER NANOPARTICLE COMPOSITION AND ELECTR...

Copper particle clusters and powder containing the same suitable as...

Copper particle clusters and powder containing the same suitable as...

Copper powder for electrically conductive paste

Copper powder and process for producing copper powder

Silver-dispersed copper powder, process for producing the powder an...

Copper particle clusters and powder containing the same suitable as...

Copper powder and process for producing copper powder