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Hiromi Kawamata

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  • Tochigi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Lead-free solder ball
    • Patent number 7,750,475
    • Issue date Jul 6, 2010
    • Senju Metal Industry Co., Ltd.
    • Daisuke Souma
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Lead-free solder ball
    • Publication number 20070069379
    • Publication date Mar 29, 2007
    • Daisuke Souma
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR