Hiromi TOMIYAMA

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and method for detecting height of bonding target
- Patent number 10,816,322
- Issue date Oct 27, 2020
- Shinkawa Ltd.
- Shigeru Hayata
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding apparatus and method of estimating position of landing poin...
- Patent number 10,586,781
- Issue date Mar 10, 2020
- Shinkawa Ltd.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bend inspection method and apparatus
- Patent number 5,818,958
- Issue date Oct 6, 1998
- Kabushiki Kaisha Shinkawa
- Hiromi Tomiyama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Workpiece conveying apparatus used with workpiece inspection device
- Patent number 5,772,040
- Issue date Jun 30, 1998
- Kabushiki Kaisha Shinkawa
- Hiromi Tomiyama
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Grant
Bonding wire height detection method
- Patent number 5,583,641
- Issue date Dec 10, 1996
- Kabushiki Kaisha Shinkawa
- Hiromi Tomiyama
- G01 - MEASURING TESTING
Information Patent Grant
Bonding wire detection method
- Patent number 5,576,828
- Issue date Nov 19, 1996
- Kabushiki Kaisha Shinkawa
- Hiromi Tomiyama
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
BONDING DEVICE AND METHOD FOR DETECTING HEIGHT OF SUBJECT
- Publication number 20200132438
- Publication date Apr 30, 2020
- SHINKAWA LTD.
- Shigeru HAYATA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING APPARATUS AND METHOD OF ESTIMATING POSITION OF LANDING POIN...
- Publication number 20170154864
- Publication date Jun 1, 2017
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR