Hiromitsu Miyai

Person

  • Tokyo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Internally reinforced bond pads

    • Patent number 7,273,804
    • Issue date Sep 25, 2007
    • International Business Machines Corporation
    • David Angell
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Internally reinforced bond pads

    • Patent number 6,864,578
    • Issue date Mar 8, 2005
    • International Business Machines Corporation
    • David Angell
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Internally reinforced bond pads

    • Publication number 20050121803
    • Publication date Jun 9, 2005
    • David Angell
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Internally reinforced bond pads

    • Publication number 20040195642
    • Publication date Oct 7, 2004
    • David Angell
    • H01 - BASIC ELECTRIC ELEMENTS