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Hiromitsu Miyai
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Internally reinforced bond pads
Patent number
7,273,804
Issue date
Sep 25, 2007
International Business Machines Corporation
David Angell
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Internally reinforced bond pads
Patent number
6,864,578
Issue date
Mar 8, 2005
International Business Machines Corporation
David Angell
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Internally reinforced bond pads
Publication number
20050121803
Publication date
Jun 9, 2005
David Angell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Internally reinforced bond pads
Publication number
20040195642
Publication date
Oct 7, 2004
David Angell
H01 - BASIC ELECTRIC ELEMENTS