Hiromitsu Takashita

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of molded article
- Patent number 9,669,567
- Issue date Jun 6, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tsuyoshi Takeda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Circuit board, and semiconductor device having component mounted on...
- Patent number 9,351,402
- Issue date May 24, 2016
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 9,332,642
- Issue date May 3, 2016
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic components assembly
- Patent number 9,204,530
- Issue date Dec 1, 2015
- Panasonic Corporation
- Hiromitsu Takashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and method for producing circuit board
- Patent number 9,175,151
- Issue date Nov 3, 2015
- Panasonic Corporation
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring method, structure having wiring provided on surface, semicon...
- Patent number 9,082,635
- Issue date Jul 14, 2015
- Panasonic Corporation
- Shingo Yoshioka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method for semiconductor package, semiconductor packa...
- Patent number 9,082,825
- Issue date Jul 14, 2015
- Panasonic Corporation
- Hiromitsu Takashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional structure for wiring formation
- Patent number 9,082,438
- Issue date Jul 14, 2015
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional structure in which wiring is provided on its surface
- Patent number 9,070,393
- Issue date Jun 30, 2015
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit board, and semiconductor device having component mounted on...
- Patent number 8,929,092
- Issue date Jan 6, 2015
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and method for producing circuit board
- Patent number 8,877,843
- Issue date Nov 4, 2014
- Panasonic Corporation
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...
- Publication number 20150271924
- Publication date Sep 24, 2015
- PANASONIC CORPORATION
- Shingo Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...
- Publication number 20150156873
- Publication date Jun 4, 2015
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF MOLDED ARTICLE
- Publication number 20150035202
- Publication date Feb 5, 2015
- PANASONIC CORPORATION
- Tsuyoshi TAKEDA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CIRCUIT BOARD
- Publication number 20150034366
- Publication date Feb 5, 2015
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD
- Publication number 20150008379
- Publication date Jan 8, 2015
- PANASONIC CORPORATION
- Yuko Konno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKA...
- Publication number 20140191406
- Publication date Jul 10, 2014
- PANASONIC CORPORATION
- Hiromitsu Takashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE
- Publication number 20140183751
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION
- Publication number 20140182887
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD
- Publication number 20130337188
- Publication date Dec 19, 2013
- PANASONIC CORPORATION
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC COMPONENTS ASSEMBLY
- Publication number 20130265729
- Publication date Oct 10, 2013
- PANASONIC CORPORATION
- Hiromitsu TAKASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...
- Publication number 20130056247
- Publication date Mar 7, 2013
- PANASONIC CORPORATION
- Shingo Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...
- Publication number 20120206891
- Publication date Aug 16, 2012
- Shingo Yoshioka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Hiromitsu Takashita

Person

Patents Grantslast 30 patents

Manufacturing method of molded article

Circuit board, and semiconductor device having component mounted on...

Circuit board

Electronic components assembly

Resin composition and method for producing circuit board

Wiring method, structure having wiring provided on surface, semicon...

Manufacturing method for semiconductor package, semiconductor packa...

Three-dimensional structure for wiring formation

Three-dimensional structure in which wiring is provided on its surface

Circuit board, and semiconductor device having component mounted on...

Resin composition and method for producing circuit board

Patents Applicationslast 30 patents

WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...

CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...

MANUFACTURING METHOD OF MOLDED ARTICLE

CIRCUIT BOARD

RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD

MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKA...

THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE

THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION

RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD

ELECTRONIC COMPONENTS ASSEMBLY

WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...

CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...