Hironao Ootake

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Separator
- Patent number 11,236,254
- Issue date Feb 1, 2022
- Nitto Denko Corporation
- Naofumi Kosaka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing/die bonding film
- Patent number 8,617,928
- Issue date Dec 31, 2013
- Nitto Denko Corporation
- Katsuhiko Kamiya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing die-bonding film
- Patent number 8,119,236
- Issue date Feb 21, 2012
- Nitto Denko Corporation
- Katsuhiko Kamiya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing die-bonding film and process for producing semiconductor device
- Patent number 7,880,316
- Issue date Feb 1, 2011
- Nitto Denko Corporation
- Hironao Ootake
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE-BONDING PRESSURE-SENSITIVE ADHESIVE MEMBER
- Publication number 20200270483
- Publication date Aug 27, 2020
- NITTO DENKO CORPORATION
- Mizuho CHIBA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEPARATOR
- Publication number 20190241769
- Publication date Aug 8, 2019
- NITTO DENKO CORPORATION
- Naofumi KOSAKA
- B32 - LAYERED PRODUCTS
Information Patent Application
WATER-DISPERSED ACRYLIC ADHESIVE COMPOSITION
- Publication number 20190194507
- Publication date Jun 27, 2019
- NITTO DENKO CORPORATION
- Mizuho CHIBA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHE...
- Publication number 20140213716
- Publication date Jul 31, 2014
- Nitto Denko Corporation
- Yoshihiro OKADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHE...
- Publication number 20130323498
- Publication date Dec 5, 2013
- Nitto Denko Corporation
- Akiko TAKAHASHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
AQUEOUS DISPERSION PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRES...
- Publication number 20120277368
- Publication date Nov 1, 2012
- Nitto Denko Corporation
- Masatsugu KOSO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET
- Publication number 20120231267
- Publication date Sep 13, 2012
- Nitto Denko Corporation
- Hironao OOTAKE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND USE THEREOF
- Publication number 20120157593
- Publication date Jun 21, 2012
- Nitto Denko Corporation
- Hironao OOTAKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE SHEET
- Publication number 20120114930
- Publication date May 10, 2012
- Nitto Denko Corporation
- Kenichi YAMAMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING/DIE BONDING FILM
- Publication number 20110104873
- Publication date May 5, 2011
- NITTO DENKO CORPORATION
- Katsuhiko Kamiya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LAMINATED FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100279468
- Publication date Nov 4, 2010
- Nitto Denko Corporation
- Hironao Ootake
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATED FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100279109
- Publication date Nov 4, 2010
- Nitto Denko Corporation
- Hironao Ootake
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATED FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100279050
- Publication date Nov 4, 2010
- Nitto Denko Corporation
- Hironao Ootake
- B32 - LAYERED PRODUCTS
Information Patent Application
DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100129985
- Publication date May 27, 2010
- Nitto Denko Corporation
- Hironao OOTAKE
- B32 - LAYERED PRODUCTS
Information Patent Application
DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100129987
- Publication date May 27, 2010
- Nitto Denko Corporation
- Katsuhiko KAMIYA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100129988
- Publication date May 27, 2010
- Nitto Denko Corporation
- Hironao OOTAKE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100129989
- Publication date May 27, 2010
- Nitto Denko Corporation
- Katsuhiko Kamiya
- B32 - LAYERED PRODUCTS
Information Patent Application
DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100129986
- Publication date May 27, 2010
- Nitto Denko Corporation
- Katsuhiko KAMIYA
- B32 - LAYERED PRODUCTS
Information Patent Application
DICING DIE-BONDING FILM
- Publication number 20100029061
- Publication date Feb 4, 2010
- Katsuhiko Kamiya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DICING DIE-BONDING FILM
- Publication number 20100029060
- Publication date Feb 4, 2010
- Katsuhiko Kamiya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DICING DIE-BONDING FILM
- Publication number 20100028687
- Publication date Feb 4, 2010
- Katsuhiko Kamiya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hironao Ootake

Person

Patents Grantslast 30 patents

Separator

Dicing/die bonding film

Dicing die-bonding film

Dicing die-bonding film and process for producing semiconductor device

Patents Applicationslast 30 patents

PRESSURE-BONDING PRESSURE-SENSITIVE ADHESIVE MEMBER

SEPARATOR

WATER-DISPERSED ACRYLIC ADHESIVE COMPOSITION

PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHE...

PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHE...

AQUEOUS DISPERSION PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRES...

DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET

PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND USE THEREOF

PRESSURE-SENSITIVE ADHESIVE SHEET

DICING/DIE BONDING FILM

LAMINATED FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

LAMINATED FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

LAMINATED FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

DICING DIE-BONDING FILM

DICING DIE-BONDING FILM

DICING DIE-BONDING FILM