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Hironari OHKUBO

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Patents Grantslast 30 patents

  • Information Patent Grant

    Dividing apparatus including an imaging unit for detecting defects...
    • Patent number 11,476,137
    • Issue date Oct 18, 2022
    • Disco Corporation
    • Hironari Ohkubo
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 11,462,439
    • Issue date Oct 4, 2022
    • Disco Corporation
    • Hironari Ohkubo
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 10,668,569
    • Issue date Jun 2, 2020
    • Disco Corporation
    • Kentaro Odanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Processing method of package wafer
    • Patent number 10,211,104
    • Issue date Feb 19, 2019
    • Disco Corporation
    • Yuta Yoshida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 10,207,362
    • Issue date Feb 19, 2019
    • Disco Corporation
    • Wataru Odagiri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,870,961
    • Issue date Jan 16, 2018
    • Disco Corporation
    • Taku Iwamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,779,994
    • Issue date Oct 3, 2017
    • Disco Corporation
    • Hironari Ohkubo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 9,724,783
    • Issue date Aug 8, 2017
    • Disco Corporation
    • Wataru Odagiri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of detecting condensing spot position in laser beam processi...
    • Patent number 8,957,347
    • Issue date Feb 17, 2015
    • Disco Corporation
    • Toshiyuki Yoshikawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20220118547
    • Publication date Apr 21, 2022
    • Disco Corporation
    • Hironari OHKUBO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20210111075
    • Publication date Apr 15, 2021
    • Disco Corporation
    • Hironari OHKUBO
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    DIVIDING APPARATUS
    • Publication number 20200335370
    • Publication date Oct 22, 2020
    • Disco Corporation
    • Hironari OHKUBO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING METHOD OF PACKAGE WAFER
    • Publication number 20180061711
    • Publication date Mar 1, 2018
    • Disco Corporation
    • Yuta Yoshida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170186656
    • Publication date Jun 29, 2017
    • Disco Corporation
    • Taku Iwamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170186646
    • Publication date Jun 29, 2017
    • Disco Corporation
    • Hironari Ohkubo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20170014947
    • Publication date Jan 19, 2017
    • Disco Corporation
    • Wataru Odagiri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20160332260
    • Publication date Nov 17, 2016
    • Disco Corporation
    • Kentaro Odanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20160151857
    • Publication date Jun 2, 2016
    • Disco Corporation
    • Wataru Odagiri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF DETECTING CONDENSING SPOT POSITION IN LASER BEAM PROCESSI...
    • Publication number 20130082038
    • Publication date Apr 4, 2013
    • Disco Corporation
    • Toshiyuki YOSHIKAWA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR