Hironobu Fujimoto

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Sheet and adhesive sheet
- Patent number 9,534,151
- Issue date Jan 3, 2017
- Lintec Corporation
- Hironobu Fujimoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Curable resin composition, curable resin molded body, cured resin m...
- Patent number 9,102,833
- Issue date Aug 11, 2015
- Lintec Corporation
- Masaharu Ito
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Curable resin composition, curable resin molded body, cured resin m...
- Patent number 9,023,913
- Issue date May 5, 2015
- Lintec Corporation
- Masaharu Ito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Holding jig, semiconductor wafer grinding method, semiconductor waf...
- Patent number 8,212,345
- Issue date Jul 3, 2012
- Shin-Etsu Polymer Co., Ltd.
- Kiyofumi Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Fixed jig, chip pickup method and chip pickup apparatus
- Patent number 8,182,649
- Issue date May 22, 2012
- Lintec Corporation
- Kenichi Watanabe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Holding jig, semiconductor wafer grinding method, semiconductor waf...
- Patent number 7,875,501
- Issue date Jan 25, 2011
- Shin-Etsu Polymer Co., Ltd.
- Kiyofumi Tanaka
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Adhesive Sheet
- Publication number 20150303093
- Publication date Oct 22, 2015
- LINTEC CORPORATION
- Hironobu Fujimoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Film, Sheet Substrate for Processing Workpiece, and Sheet for Proce...
- Publication number 20150111032
- Publication date Apr 23, 2015
- LINTEC CORPORATION
- Hironobu Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE RESIN COMPOSITION, CURABLE RESIN MOLDED BODY, CURED RESIN M...
- Publication number 20140364531
- Publication date Dec 11, 2014
- Masaharu Ito
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CURABLE RESIN COMPOSITION, CURABLE RESIN MOLDED BODY, CURED RESIN M...
- Publication number 20140350187
- Publication date Nov 27, 2014
- LINTEC CORPORATION
- Masaharu Ito
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
GAS BARRIER FILM, METHOD FOR PRODUCING SAME, GAS BARRIER FILM LAMIN...
- Publication number 20140308494
- Publication date Oct 16, 2014
- Wataru Iwaya
- B32 - LAYERED PRODUCTS
Information Patent Application
HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAF...
- Publication number 20110281509
- Publication date Nov 17, 2011
- Lintec Corporation
- KIYOFUMI TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
Sheet and Adhesive Sheet
- Publication number 20110070433
- Publication date Mar 24, 2011
- LINTEC CORPORATION
- Hironobu Fujimoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Fixed Jig, Chip Pickup Method and Chip Pickup Apparatus
- Publication number 20100314894
- Publication date Dec 16, 2010
- LINTEC CORPORATION
- Kenichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Pickup Method and Chip Pickup Apparatus
- Publication number 20100289283
- Publication date Nov 18, 2010
- LINTEC CORPORATION
- Kenichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAF...
- Publication number 20090081852
- Publication date Mar 26, 2009
- Shin-etsu Polymer Co., Ltd.
- Kiyofumi Tanaka
- B24 - GRINDING POLISHING

Hironobu Fujimoto

Person

Patents Grantslast 30 patents

Sheet and adhesive sheet

Curable resin composition, curable resin molded body, cured resin m...

Curable resin composition, curable resin molded body, cured resin m...

Holding jig, semiconductor wafer grinding method, semiconductor waf...

Fixed jig, chip pickup method and chip pickup apparatus

Holding jig, semiconductor wafer grinding method, semiconductor waf...

Patents Applicationslast 30 patents

Adhesive Sheet

Film, Sheet Substrate for Processing Workpiece, and Sheet for Proce...

CURABLE RESIN COMPOSITION, CURABLE RESIN MOLDED BODY, CURED RESIN M...

CURABLE RESIN COMPOSITION, CURABLE RESIN MOLDED BODY, CURED RESIN M...

GAS BARRIER FILM, METHOD FOR PRODUCING SAME, GAS BARRIER FILM LAMIN...

HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAF...

Sheet and Adhesive Sheet

Fixed Jig, Chip Pickup Method and Chip Pickup Apparatus

Chip Pickup Method and Chip Pickup Apparatus

HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAF...