Hironobu Ikeda

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component, and electronic component manufacturing method
- Patent number 10,643,976
- Issue date May 5, 2020
- NEC Corporation
- Yurika Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic component manufacturing method
- Patent number 10,334,721
- Issue date Jun 25, 2019
- NEC Corporation
- Hironobu Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for adjusting position of electronic component
- Patent number 7,896,658
- Issue date Mar 1, 2011
- NEC Corporation
- Hironobu Ikeda
- G01 - MEASURING TESTING
Information Patent Grant
Heat sink, an electronic component package, and a method of manufac...
- Patent number 7,755,895
- Issue date Jul 13, 2010
- NEC Corporation
- Hironobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for moderating stresses cause by a difference in thermal...
- Patent number 7,671,477
- Issue date Mar 2, 2010
- NEC Corporation
- Hironobu Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board reducing a warp and a method of mounting an integrate...
- Patent number 6,518,666
- Issue date Feb 11, 2003
- NEC Corporation
- Hironobu Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure for an LSI
- Patent number 6,285,553
- Issue date Sep 4, 2001
- NEC Corporation
- Takayuki Suyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 6,271,480
- Issue date Aug 7, 2001
- NEC Corporation
- Yukio Yamaguti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a connection substrate with tur...
- Patent number 6,087,716
- Issue date Jul 11, 2000
- NEC Corporation
- Hironobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for one or more semiconductor devices
- Patent number 5,973,930
- Issue date Oct 26, 1999
- NEC Corporation
- Hironobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling structure for integrated circuit
- Patent number 5,436,501
- Issue date Jul 25, 1995
- NEC Corporation
- Hironobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling structure for integrated circuits
- Patent number 5,285,351
- Issue date Feb 8, 1994
- NEC Corporation
- Hironobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT MANUFACTURING METHOD
- Publication number 20180261577
- Publication date Sep 13, 2018
- NEC Corporation
- Yurika OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MANUFACTURING METHOD
- Publication number 20180220528
- Publication date Aug 2, 2018
- NEC Corporation
- Hironobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for adjusting position of electronic component
- Publication number 20090068861
- Publication date Mar 12, 2009
- NEC Corporation
- Hironobu Ikeda
- G01 - MEASURING TESTING
Information Patent Application
DEVICE, AND MANUFACTURING METHOD FOR THE DEVICE
- Publication number 20070090528
- Publication date Apr 26, 2007
- NEC Corporation
- Hironobu Ikeda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Heat sink, an electronic component package, and a method of manufac...
- Publication number 20060185896
- Publication date Aug 24, 2006
- NEC Corporation
- Hironobu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS

Hironobu Ikeda

Person

Patents Grantslast 30 patents

Electronic component, and electronic component manufacturing method

Electronic component and electronic component manufacturing method

Apparatus and method for adjusting position of electronic component

Heat sink, an electronic component package, and a method of manufac...

Technique for moderating stresses cause by a difference in thermal...

Circuit board reducing a warp and a method of mounting an integrate...

Mounting structure for an LSI

Electronic device

Semiconductor device package having a connection substrate with tur...

Mounting structure for one or more semiconductor devices

Cooling structure for integrated circuit

Cooling structure for integrated circuits

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT MANUFACTURING METHOD

ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MANUFACTURING METHOD

Apparatus and method for adjusting position of electronic component

DEVICE, AND MANUFACTURING METHOD FOR THE DEVICE

Heat sink, an electronic component package, and a method of manufac...