Hironobu Moriyama

Person

Shinagawa-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Protective tape and method for manufacturing semiconductor device
- Patent number 10,483,148
- Issue date Nov 19, 2019
- Dexerials Corporation
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective tape and method for manufacturing semiconductor device u...
- Patent number 10,312,125
- Issue date Jun 4, 2019
- Dexerials Corporation
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 10,062,625
- Issue date Aug 28, 2018
- Dexerials Corporation
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,957,411
- Issue date May 1, 2018
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective tape and method for manufacturing a semiconductor device...
- Patent number 9,741,598
- Issue date Aug 22, 2017
- Dexerials Corporation
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material and method for manufacturing semiconductor devic...
- Patent number 9,653,371
- Issue date May 16, 2017
- Dexerials Corporation
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit connecting material and semiconductor device manufacturing...
- Patent number 9,202,755
- Issue date Dec 1, 2015
- Dexerials Corporation
- Hironobu Moriyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy resin composition, method for producing composite unit using...
- Patent number 8,802,776
- Issue date Aug 12, 2014
- Dexerials Corporation
- Taichi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid absorbing sheet and nonaqueous electrolyte battery pack
- Patent number 7,510,767
- Issue date Mar 31, 2009
- Sony Corporation
- Kouki Hatsuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Battery packs
- Patent number 7,445,868
- Issue date Nov 4, 2008
- Sony Chemical & Information Device Corporation
- Yoshito Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid absorbing sheet and nonaqueous electrolyte battery pack
- Patent number 7,399,531
- Issue date Jul 15, 2008
- Sony Corporation
- Hironobu Moriyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
PROTECTIVE TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180286737
- Publication date Oct 4, 2018
- DEXERIALS CORPORATION
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE U...
- Publication number 20180151405
- Publication date May 31, 2018
- DEXERIALS CORPORATION
- Hironobu MORIYAMA
- B32 - LAYERED PRODUCTS
Information Patent Application
UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20170221787
- Publication date Aug 3, 2017
- DEXERIALS CORPORATION
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill Material and Method for Manufacturing Semiconductor Devic...
- Publication number 20160194517
- Publication date Jul 7, 2016
- DEXERIALS CORPORATION
- Takayuki SAITO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROTECTIVE TAPE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE...
- Publication number 20160181140
- Publication date Jun 23, 2016
- DEXERIALS CORPORATION
- Hironobu MORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20150348859
- Publication date Dec 3, 2015
- DEXERIALS CORPORATION
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE MANUFACTURING...
- Publication number 20150140738
- Publication date May 21, 2015
- DEXERIALS CORPORATION
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING COMPOSITE UNIT USING...
- Publication number 20120281376
- Publication date Nov 8, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Taichi Koyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid absorbing sheet and nonaqueous electrolyte battery pack
- Publication number 20090148776
- Publication date Jun 11, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kouki Hatsuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BATTERY PACKS
- Publication number 20070292723
- Publication date Dec 20, 2007
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Yoshito Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid absorbing sheet and nonaqueous electrolyte battery pack
- Publication number 20060188724
- Publication date Aug 24, 2006
- Sony Chemical Corp
- Hironobu Moriyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Liquid absorbing sheet and nonaqueous electrolyte battery pack
- Publication number 20060172199
- Publication date Aug 3, 2006
- Sony Chemicals Corp.
- Kouki Hatsuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hironobu Moriyama

Person

Patents Grantslast 30 patents

Protective tape and method for manufacturing semiconductor device

Protective tape and method for manufacturing semiconductor device u...

Underfill material and method for manufacturing semiconductor devic...

Underfill material and method for manufacturing semiconductor devic...

Protective tape and method for manufacturing a semiconductor device...

Underfill material and method for manufacturing semiconductor devic...

Circuit connecting material and semiconductor device manufacturing...

Epoxy resin composition, method for producing composite unit using...

Liquid absorbing sheet and nonaqueous electrolyte battery pack

Battery packs

Liquid absorbing sheet and nonaqueous electrolyte battery pack

Patents Applicationslast 30 patents

PROTECTIVE TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROTECTIVE TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE U...

UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...

Underfill Material and Method for Manufacturing Semiconductor Devic...

PROTECTIVE TAPE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE...

UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVIC...

CIRCUIT CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE MANUFACTURING...

EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING COMPOSITE UNIT USING...

Liquid absorbing sheet and nonaqueous electrolyte battery pack

BATTERY PACKS

Liquid absorbing sheet and nonaqueous electrolyte battery pack

Liquid absorbing sheet and nonaqueous electrolyte battery pack