Hironobu Omura

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Extruding mechanism for film packs
- Patent number 6,234,348
- Issue date May 22, 2001
- Cemedine Co., Ltd.
- Naomi Okamura
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...