Hironori KOBAYASHI

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin composition for semiconductor encapsulation and semicon...
- Patent number 8,421,249
- Issue date Apr 16, 2013
- Nitto Denko Corporation
- Hironori Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Component supply head device and component mounting head device
- Patent number 7,650,691
- Issue date Jan 26, 2010
- Panasonic Corporation
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ION CONDUCTIVE SOLID AND ALL-SOLID-STATE BATTERY
- Publication number 20220302497
- Publication date Sep 22, 2022
- CANON OPTRON, INC.
- Yoshitaka SHIBA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
BEAD FOAM, RESIN COMPOSITE PROVIDED WITH SAME, AND METHOD FOR PRODU...
- Publication number 20200123339
- Publication date Apr 23, 2020
- SEKISUI PLASTICS CO., LTD.
- Hironori KOBAYASHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...
- Publication number 20110272828
- Publication date Nov 10, 2011
- Nitto Denko Corporation
- Hironori KOBAYASHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE
- Publication number 20100064510
- Publication date Mar 18, 2010
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Supply Head Device And Component Mounting Head Device
- Publication number 20080040917
- Publication date Feb 21, 2008
- Shoriki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component mounting method and component mounting apparatus
- Publication number 20070181644
- Publication date Aug 9, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yasuharu Ueno
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Hironori KOBAYASHI

Person

Patents Grantslast 30 patents

Epoxy resin composition for semiconductor encapsulation and semicon...

Component supply head device and component mounting head device

Patents Applicationslast 30 patents

ION CONDUCTIVE SOLID AND ALL-SOLID-STATE BATTERY

BEAD FOAM, RESIN COMPOSITE PROVIDED WITH SAME, AND METHOD FOR PRODU...

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...

COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE

Component Supply Head Device And Component Mounting Head Device

Component mounting method and component mounting apparatus