Hironori Matsushima

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,087,816
- Issue date Jul 21, 2015
- Renesas Electronics Corporation
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,024,454
- Issue date May 5, 2015
- Renesas Electronics Corporation
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper wire having different width portions
- Patent number 8,772,952
- Issue date Jul 8, 2014
- Renesas Electronics Corporation
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,692,383
- Issue date Apr 8, 2014
- Renesas Electronics Coporation
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,629,002
- Issue date Jan 14, 2014
- Renesas Electronics Corporation
- Soshi Kuroda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,334,172
- Issue date Dec 18, 2012
- Renesas Electronics Corporation
- Soshi Kuroda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring design support apparatus for bond wire of semiconductor devices
- Patent number 7,725,847
- Issue date May 25, 2010
- Mitsubishi Denki Kabushiki Kaisha
- Akihiro Goto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with reduced wiring paths between an array of...
- Patent number 6,984,882
- Issue date Jan 10, 2006
- Renesas Technology Corp.
- Hironori Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and manufacturing method thereof
- Patent number 6,515,360
- Issue date Feb 4, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Hironori Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiating plate structure and method for manufacturing semiconducto...
- Patent number 6,399,422
- Issue date Jun 4, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,384,485
- Issue date May 7, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Hironori Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a packaged semiconductor element and pe...
- Patent number 6,232,652
- Issue date May 15, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Hironori Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package and manufacturing method of the same
- Patent number 6,191,493
- Issue date Feb 20, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a ball grid array
- Patent number 6,184,586
- Issue date Feb 6, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Hironori Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package and manufacturing method of the same
- Patent number 5,920,770
- Issue date Jul 6, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package
- Patent number 5,753,973
- Issue date May 19, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package
- Patent number 5,656,863
- Issue date Aug 12, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140273353
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20140175678
- Publication date Jun 26, 2014
- RENESAS ELECTRONICS CORPORATION
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20130065364
- Publication date Mar 14, 2013
- RENESAS ELECTRIC CORPORATION
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120061850
- Publication date Mar 15, 2012
- Renesas Electronics Corporation
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20110201155
- Publication date Aug 18, 2011
- Renesas Electronics Corporation
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110074019
- Publication date Mar 31, 2011
- Renesas Electronics Corporation
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100320623
- Publication date Dec 23, 2010
- Renesas Electronics Corporation
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design Support Apparatus for Semiconductor Devices
- Publication number 20080250363
- Publication date Oct 9, 2008
- Mitsubishi Denki Kabushiki Kaisha
- Akihiro Goto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor device
- Publication number 20030234434
- Publication date Dec 25, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Hironori Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged semiconductor device and manufacturing method thereof
- Publication number 20010040288
- Publication date Nov 15, 2001
- Hironori Matsushima
- H01 - BASIC ELECTRIC ELEMENTS

Hironori Matsushima

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device

Semiconductor device with copper wire having different width portions

Semiconductor device and method of manufacturing the same

Manufacturing method of semiconductor device

Manufacturing method of semiconductor device

Wiring design support apparatus for bond wire of semiconductor devices

Semiconductor device with reduced wiring paths between an array of...

Packaged semiconductor device and manufacturing method thereof

Radiating plate structure and method for manufacturing semiconducto...

Semiconductor device

Semiconductor device having a packaged semiconductor element and pe...

Resin seal semiconductor package and manufacturing method of the same

Semiconductor device including a ball grid array

Resin seal semiconductor package and manufacturing method of the same

Resin seal semiconductor package

Resin seal semiconductor package

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Manufacturing the Same

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Design Support Apparatus for Semiconductor Devices

Semiconductor device

Packaged semiconductor device and manufacturing method thereof