Hironori MURAKAMI

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Kobe-shi, Hyogo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Structure including copper plating layer or copper alloy plating layer
- Patent number 11,993,862
- Issue date May 28, 2024
- Ishihara Chemical Co., LTD
- Masaru Hatabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper or copper alloy electroplating bath
- Patent number 11,946,153
- Issue date Apr 2, 2024
- Ishihara Chemical Co., LTD
- Masaru Hatabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE INCLUDING COPPER PLATING LAYER OR COPPER ALLOY PLATING LAYER
- Publication number 20220316085
- Publication date Oct 6, 2022
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER OR COPPER ALLOY ELECTROPLATING BATH
- Publication number 20220127741
- Publication date Apr 28, 2022
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR