Hironori Sakamoto

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Kokubu-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin compositions and premolded semiconductor packages
- Patent number 6,569,532
- Issue date May 27, 2003
- Sony Corporation
- Kazutoshi Tomiyoshi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Epoxy resin compositions and premolded semiconductor packages
- Publication number 20020076558
- Publication date Jun 20, 2002
- Shin-Etsu Company Co., Ltd.
- Kazutoshi Tomiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy resin compositions and premolded semiconductor packages
- Publication number 20010004651
- Publication date Jun 21, 2001
- Kazutoshi Tomiyoshi
- H01 - BASIC ELECTRIC ELEMENTS