Hironori Tanaka

Person

Ibi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board with built-in capacitor
- Patent number 9,226,399
- Issue date Dec 29, 2015
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed wiring board
- Patent number 9,101,070
- Issue date Aug 4, 2015
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed wiring board
- Patent number 8,832,935
- Issue date Sep 16, 2014
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-dielectric sheet, a printed circuit board having the high-diel...
- Patent number 8,837,160
- Issue date Sep 16, 2014
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-dielectric sheet, a printed circuit board having the high-diel...
- Patent number 8,707,552
- Issue date Apr 29, 2014
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,624,132
- Issue date Jan 7, 2014
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board with built-in electron...
- Patent number 8,613,136
- Issue date Dec 24, 2013
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 8,575,496
- Issue date Nov 5, 2013
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board including a capacitor section
- Patent number 8,471,153
- Issue date Jun 25, 2013
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with low-elasticity layer and low-thermal-expansion layer
- Patent number 8,455,766
- Issue date Jun 4, 2013
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor-incorporated printed wiring board and electronic component
- Patent number 8,391,015
- Issue date Mar 5, 2013
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board with built-in electron...
- Patent number 8,336,205
- Issue date Dec 25, 2012
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed wiring board with built-in electr...
- Patent number 8,291,584
- Issue date Oct 23, 2012
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed wiring board
- Patent number 8,237,060
- Issue date Aug 7, 2012
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with a built-in resistive element
- Patent number 8,208,267
- Issue date Jun 26, 2012
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,198,546
- Issue date Jun 12, 2012
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a multilayer printed wiring board for prov...
- Patent number 8,186,046
- Issue date May 29, 2012
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board with a built-in capacitor
- Patent number 8,115,113
- Issue date Feb 14, 2012
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 8,108,990
- Issue date Feb 7, 2012
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board with built-in electron...
- Patent number 8,024,858
- Issue date Sep 27, 2011
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,022,314
- Issue date Sep 20, 2011
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,017,875
- Issue date Sep 13, 2011
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,003,897
- Issue date Aug 23, 2011
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed wiring board with built-in electron...
- Patent number 7,935,893
- Issue date May 3, 2011
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 7,888,803
- Issue date Feb 15, 2011
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 7,817,440
- Issue date Oct 19, 2010
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 7,714,233
- Issue date May 11, 2010
- Ibiden Co., Ltd.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 7,649,748
- Issue date Jan 19, 2010
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical fiber array
- Patent number 7,578,625
- Issue date Aug 25, 2009
- Ibiden Co., Ltd.
- Hironori Tanaka
- G02 - OPTICS
Information Patent Grant
Wiring board with built-in capacitor
- Patent number 7,436,681
- Issue date Oct 14, 2008
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRING BOARD FOR PROVI...
- Publication number 20120170240
- Publication date Jul 5, 2012
- IBIDEN CO., LTD.
- Hironori Tanaka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120037414
- Publication date Feb 16, 2012
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRON...
- Publication number 20110289773
- Publication date Dec 1, 2011
- IBIDEN CO., LTD.
- Hironori Tanaka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110271524
- Publication date Nov 10, 2011
- IBIDEN CO., LTD.
- Hironori TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIEL...
- Publication number 20110259629
- Publication date Oct 27, 2011
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD WITH A BUILT-IN RESISTIVE ELEMENT
- Publication number 20110252639
- Publication date Oct 20, 2011
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110252638
- Publication date Oct 20, 2011
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20110214915
- Publication date Sep 8, 2011
- IBIDEN CO., LTD.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20110061232
- Publication date Mar 17, 2011
- IBIDEN CO., LTD.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN CAPACITOR
- Publication number 20110061921
- Publication date Mar 17, 2011
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIEL...
- Publication number 20100200285
- Publication date Aug 12, 2010
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing capacitor device
- Publication number 20100181285
- Publication date Jul 22, 2010
- IBIDEN, CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20100155129
- Publication date Jun 24, 2010
- IBIDEN CO., LTD.
- Yoichiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20100065323
- Publication date Mar 18, 2010
- IBIDEN CO., LTD.
- Yoichiro Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20100064512
- Publication date Mar 18, 2010
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRON...
- Publication number 20100043942
- Publication date Feb 25, 2010
- IBIDEN CO., LTD.
- Hironori Tanaka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND MANUFAC...
- Publication number 20090293271
- Publication date Dec 3, 2009
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
- Publication number 20090244865
- Publication date Oct 1, 2009
- IBIDEN CO., LTD.
- Hironori Tanaka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for Manufacturing A Multilayer Printed Wiring Board for Prov...
- Publication number 20090242252
- Publication date Oct 1, 2009
- IBIDEN CO., LTD.
- Hironori Tanaka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CAPACITOR-INCORPORATED PRINTED WIRING BOARD AND ELECTRONIC COMPONENT
- Publication number 20090231820
- Publication date Sep 17, 2009
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRON...
- Publication number 20090205202
- Publication date Aug 20, 2009
- IBIDEN CO., LTD.
- Hironori Tanaka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRON...
- Publication number 20090205859
- Publication date Aug 20, 2009
- IBIDEN CO., LTD.
- Hironori Tanaka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED WIRING BOARD WITH A BUILT-IN RESISTIVE ELEMENT
- Publication number 20090145643
- Publication date Jun 11, 2009
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board and method of manufacturing the same
- Publication number 20090139760
- Publication date Jun 4, 2009
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20090129039
- Publication date May 21, 2009
- IBIDEN CO., LTD
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20090064493
- Publication date Mar 12, 2009
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR MOUNTING IC CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090038830
- Publication date Feb 12, 2009
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090038835
- Publication date Feb 12, 2009
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20080149369
- Publication date Jun 26, 2008
- IBIDEN CO., LTD.
- Yoichiro KAWAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING BOARD WITH BUILT-IN CAPACITOR
- Publication number 20080127470
- Publication date Jun 5, 2008
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hironori Tanaka

Person

Patents Grantslast 30 patents

Wiring board with built-in capacitor

Method for manufacturing multilayer printed wiring board

Method of manufacturing a printed wiring board

High-dielectric sheet, a printed circuit board having the high-diel...

High-dielectric sheet, a printed circuit board having the high-diel...

Printed wiring board

Method of manufacturing printed wiring board with built-in electron...

Multilayer printed wiring board and method of manufacturing the same

Multilayer printed wiring board including a capacitor section

Substrate with low-elasticity layer and low-thermal-expansion layer

Capacitor-incorporated printed wiring board and electronic component

Method of manufacturing printed wiring board with built-in electron...

Method of manufacturing a printed wiring board with built-in electr...

Method for manufacturing multilayer printed wiring board

Printed wiring board with a built-in resistive element

Printed wiring board

Method for manufacturing a multilayer printed wiring board for prov...

Multilayer printed wiring board with a built-in capacitor

Method for manufacturing printed circuit board

Method of manufacturing printed wiring board with built-in electron...

Printed wiring board

Printed wiring board

Printed wiring board

Method of manufacturing printed wiring board with built-in electron...

Printed circuit board

Multilayer printed wiring board

Printed wiring board

Multilayer printed wiring board

Optical fiber array

Wiring board with built-in capacitor

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRING BOARD FOR PROVI...

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRON...

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIEL...

PRINTED WIRING BOARD WITH A BUILT-IN RESISTIVE ELEMENT

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED WIRING BOARD

PRINTED WIRING BOARD

WIRING BOARD WITH BUILT-IN CAPACITOR

HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIEL...

Method of manufacturing capacitor device

PRINTED WIRING BOARD

PRINTED WIRING BOARD

MULTILAYER PRINTED WIRING BOARD

METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRON...

PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND MANUFAC...

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

Method for Manufacturing A Multilayer Printed Wiring Board for Prov...

CAPACITOR-INCORPORATED PRINTED WIRING BOARD AND ELECTRONIC COMPONENT

METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRON...

METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRON...

PRINTED WIRING BOARD WITH A BUILT-IN RESISTIVE ELEMENT

Multilayer printed wiring board and method of manufacturing the same

MULTILAYER PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD

SUBSTRATE FOR MOUNTING IC CHIP AND METHOD OF MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

WIRING BOARD WITH BUILT-IN CAPACITOR