Hironori Urasawa

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Niigata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of soldering semiconductor part and mounted structure of sem...
- Patent number 7,199,329
- Issue date Apr 3, 2007
- Niigata Seimitsu Co., Ltd.
- Akihiro Mano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board transferring apparatus and method and solder ball mou...
- Patent number 6,976,616
- Issue date Dec 20, 2005
- Niigata Seimitsu Co., Ltd.
- Akihiro Mano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD TRANSFERRING APPARATUS AND METHOD AND SOLDER BALL MOU...
- Publication number 20050035182
- Publication date Feb 17, 2005
- Niigata Seimitsu Co., Ltd.
- Akihiro Mano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF SOLDERING SEMICONDUCTOR PART AND MOUNTED STRUCTURE OF SEM...
- Publication number 20050035184
- Publication date Feb 17, 2005
- Niigata Seimitsu Co., Ltd.
- Akihiro Mano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR